Headset microphone boom assembly

1. A microphone boom assembly comprising:

a first microphone to be positioned proximate to at least one first aperture in a first side of a microphone boom, acoustic signals to propagate to the first microphone through the at least one first aperture, and a second microphone to be positioned proximate to at least one second aperture in a second side of the microphone boom, acoustic signals to propagate to the second microphone through the at least one second aperture; and

a flexible printed circuit comprising a first side and a second side, the second side of the flexible printed circuit generally parallel and opposite to the first side of the flexible printed circuit, the first microphone connected to the first side of the flexible printed circuit at a first location and the second microphone connected to the second side of the flexible printed circuit at a second location, the flexible printed circuit to be mounted into the microphone boom with a bend in the flexible printed circuit, the bend positioned between the first location and the second location.

2. The microphone boom of claim 1 , wherein:

the first microphone is bottom ported and a third aperture is defined in the flexible printed circuit, to be aligned with an acoustic port of the first microphone, through which the acoustic signals propagate to the first microphone; and

the second microphone is bottom ported and a fourth aperture is defined in the flexible printed circuit board, aligned with an acoustic port of the second microphone, through which the acoustic signals propagate to the second microphone.

3. The microphone boom of claim 2 , wherein a portion of the microphone boom in which a microphone is positioned has a thickness of approximately 2.8 mm.

4. The microphone boom of claim 1 , wherein:

the first microphone is top ported, an acoustic port of the first microphone defined in a first side of the first microphone opposing a second side of the first microphone connecting the first microphone to the flexible printed circuit board; and

the second microphone is top ported, an acoustic port of the second microphone defined in a first side of the second microphone opposing a second side of the second microphone connecting the second microphone to the flexible printed circuit board.

5. The microphone boom of claim 4 , wherein a portion of the microphone boom in which the microphones are positioned has a thickness of approximately 3.0 mm.

6. The microphone boom of claim 1 , wherein the microphone boom is configured to slidably engage a housing of a headset, the microphone boom selectively moveable between a retracted position in which at least part of a near portion of the microphone boom tracts into the housing of the headset and an extended position in which the part of the near portion of the microphone boom at least partially extends away from the housing of the headset.

7. The microphone boom of claim 6 , wherein the near portion of the microphone boom has a thickness of approximately 1.7 mm.

8. The microphone boom of claim 6 , further comprising:

a magnet positioned in the near portion of the microphone boom, the magnet triggering a Hall effect sensor to generate at least one signal processed by a processor or controller to determine a position of the microphone boom with respect to the housing of the headset.

9. A headset comprising:

a main housing;

a microphone boom comprising a boom housing, the boom housing extending from the main housing and including a first aperture on a first side and a second aperture on a second side; and

a microphone assembly, the microphone assembly including a first microphone, a second microphone, and a flexible printed circuit, the flexible printed circuit comprising a first side and a second side, the second side of the flexible printed circuit generally parallel and opposite to the first side of the flexible printed circuit, the first microphone carried on the first side of the flexible printed circuit, and the second microphone carried on the second side of the flexible printed circuit;

the microphone assembly carried in the microphone boom with the first microphone proximate to a first aperture in a first side of the microphone boom housing, acoustic signals for the first microphone to propagate through the first aperture, the second microphone positioned proximate to a second aperture in a second side of the microphone boom housing, acoustic signals for the second microphone to propagate through the second aperture, the flexible printed circuit carried in the microphone boom housing with a bend in the flexible printed circuit board, the bend positioned between the first location and the second location.

10. The headset of claim 9 , wherein:

the first microphone is bottom ported and a third aperture is defined in the flexible printed circuit board, aligned with an acoustic port of the first microphone, through which the acoustic signals propagate to the first microphone; and

the second microphone is bottom ported and a fourth aperture is defined in the flexible printed circuit board, aligned with an acoustic port of the second microphone, through which the acoustic signals propagate to the second microphone.

11. The headset of claim 10 , wherein a portion of the microphone boom in which the microphones are positioned has a thickness of approximately 2.8 mm.

12. The headset of claim 9 , wherein:

the first microphone is top ported, an acoustic port of the first microphone defined in a first side of the first microphone opposing a second side of the first microphone connecting the first microphone to the flexible printed circuit board; and

the second microphone is top ported, an acoustic port of the second microphone defined in a first side of the second microphone opposing a second side of the second microphone connecting the second microphone to the flexible printed circuit board.

13. The headset of claim 12 , wherein a portion of the microphone boom in which the microphones are positioned has a thickness of approximately 3.0 mm.

14. The headset of claim 9 , wherein the microphone boom is configured to slidably engage a housing of the headset, the microphone boom selectively moveable between a retracted position in which at least part of a near portion of the microphone boom tracts into the housing of the headset and an extended position in which the part of the near portion of the microphone boom at least partially extends away from the housing of the headset.

15. The headset of claim 14 , wherein the near portion of the microphone boom has a thickness of approximately 1.7 mm.

16. The headset of claim 14 , further comprising:

a magnet positioned in an aperture defined in the near portion of the microphone boom, the magnet triggering a Hall effect sensor to generate at least one signal processed by a processor or controller to determine a position of the microphone boom with respect to the housing of the headset.

17. A method of assembling a microphone boom comprising:

connecting a first microphone to a first side of a flexible printed circuit board at a first location;

connecting a second microphone to a second side of the flexible printed circuit board at a second location, the second side of the flexible printed circuit board generally parallel and opposite to the first side of the flexible printed circuit board; and

mounting into the microphone boom the flexible printed circuit board, wherein the first microphone is positioned proximate to a first aperture defined in a first side of the microphone boom through which acoustic signals propagate to the first microphone, the second microphone is positioned proximate to a second aperture defined in a second side of the microphone through which the acoustic signals propagate to the second microphone, and a bend formed in the flexible printed circuit board, the bend positioned between the first location and the second location.

18. The method of claim 17 , wherein:

the first microphone is bottom ported and a third aperture is defined in the flexible printed circuit board, aligned with an acoustic port of the first microphone, through which the acoustic signals propagate to the first microphone; and

the second microphone is bottom ported and a fourth aperture is defined in the flexible printed circuit board, aligned with an acoustic port of the second microphone, through which the acoustic signals propagate to the second microphone.

19. The method of claim 17 , wherein:

the first microphone is top ported, an acoustic port of the first microphone defined in a first side of the first microphone opposing a second side of the first microphone connecting the first microphone to the flexible printed circuit board; and

the second microphone is top ported, an acoustic port of the second microphone defined in a first side of the second microphone opposing a second side of the second microphone connecting the second microphone to the flexible printed circuit board.

20. The method of claim 17 , wherein the microphone boom is configured to slidably engage a housing of a headset, the microphone boom selectively moveable between a retracted position in which at least part of a near portion of the microphone boom tracts into the housing of the headset and an extended position in which the part of the near portion of the microphone boom at least partially extends away from the housing of the headset.