Method for manufacturing a silicon monocrystal seed and a silicon-wafer, silicon-wafer and silicon solar-cell

1. Method for manufacturing Silicon-wafers,

in which a silicon monocrystal seed is arranged in the bottom region of a crucible, wherein the silicon monocrystal seed has a seed surface with a {110}-crystal orientation parallel to the bottom region of the crucible,

in which liquid high-purity silicon is solidified, starting from the seed surface of the silicon monocrystal seeds, thereby forming a silicon block, and

in which the silicon block is split into Silicon-wafers in such a manner that a wafer surface has a {100}-crystal orientation,

wherein,

the silicon monocrystal seed is composed of several tracks, which are manufactured from a silicon monocrystal block, the block axis of which has a [110]-spatial orientation,

wherein the silicon monocrystal block is cut-off in tracks parallel to the block axis for forming the seed surface of the silicon monocrystal seed with the {110}-crystal orientation and the lateral surface of the silicon monocrystal seed with the {100}-crystal orientation,

wherein the tracks are combined in order to almost completely cover the bottom region of the crucible,

wherein during splitting into Silicon-wafers, the silicon block formed in the crucible is divided at first, into rectangular silicon cuboids, the cuboid axis of which respectively extends parallel to the seed surface of the silicon monocrystal seed and perpendicular to the tracks of the silicon monocrystal seed, and then the silicon cuboids are cut-off across the cuboid axis.

2. Method according to claim 1 , wherein the silicon monocrystal block for the silicon monocrystal seed is produced by means of Czochralski-method or the Floating zone melting method.

3. Method according to claim 1 , wherein in at least one track, the lateral surface with the {100}-crystal orientation extends undivided over a lateral length of the crucible base.

4. Silicon-wafer manufactured by a method according to claim 1 .

5. Silicon-wafer according to claim 4 , wherein the {100}-wafer surface is texture-etched by an alkali etching process, wherein the etched wafer surface has pyramid shaped elevations, wherein the edges of the base surface of the pyramid shaped elevations extend parallel to the outer edges of the wafer surface.

6. Silicon-wafer according to claim 4 , wherein the wafer has a gradient of concentration of carbon, oxygen and/or boron in the silicon over the {100}-wafer surface.

7. Silicon-wafer according to claim 4 , wherein the wafer has a gradient of the electrical conductivity over the {100}-wafer surface.

8. Silicon solar-cell with a Silicon-wafer according to claim 4 , wherein a p/n-junction is configured between the {100}-wafer front- and rear side, wherein the {100}-wafer front-side has a coating and wherein at least the wafer rear-side is provided with contacts.

9. Method according to claim 1 , wherein in all tracks, the lateral surface with the {100}-crystal orientation extends undivided over a lateral length of the crucible base.

10. Method according to claim 1 , wherein the silicon block has an edge length of at least 70 cm and a block height of at least 30 cm.

11. Method according to claim 1 , wherein the silicon monocrystal seed has a thickness of at least 1 cm.