Semiconductor wafer and method for manufacturing semiconductor device

1. A semiconductor wafer comprising:

patterns transferred to a plurality of shot regions of the semiconductor wafer respectively,

a plurality of chip regions being formed in the plurality of shot regions respectively, the plurality of chip regions including first chip regions functioning as ordinary semiconductor chips and a second chip region functioning as a semiconductor chip used as a mark, the second chip region being provided one for each of the plurality of shot regions, the plurality of chips regions other than the second chip region being the first chip regions,

a plurality of first dummy patterns being formed respectively in the first chip region, the plurality of first dummy patterns being arranged repeatedly in a first manner, the first dummy patterns being not electrically connected to any interconnection layers,

a plurality of second dummy patterns being formed respectively in the second chip region, the plurality of second dummy patterns being arranged repeatedly in a second manner different from the first manner, the second dummy patterns being not electrically connected to any interconnection layers.

2. The semiconductor wafer according to claim 1 , wherein

a configuration of the first dummy pattern and a configuration of the second dummy pattern are different from each other.

3. The semiconductor wafer according to claim 1 , wherein

an arrangement direction of the first dummy patterns and an arrangement direction of the second dummy patterns are different from each other.

4. The semiconductor wafer according to claim 1 , wherein

the first dummy pattern and the second dummy pattern are formed in an uppermost metal interconnection layer of a plurality of metal interconnection layers.

5. A method for manufacturing a semiconductor device comprising:

exposing sequentially each of a plurality of shot region on a semiconductor wafer by using a reticle having a plurality of pattern regions, a plurality of first dummy patterns being arranged repeatedly in a first manner in a first pattern region of the plurality of pattern regions, the first dummy patterns being not electrically connected to any interconnection layers, and a plurality of second dummy patterns being arranged repeatedly in a second manner different from the first manner in a second pattern region of the plurality of pattern regions, the second dummy patterns being not electrically connected to any interconnection layers, wherein

a plurality of chip regions are formed in the plurality of shot regions respectively, the plurality of chip regions including first chip regions functioning as ordinary semiconductor chips and a second chip region functioning as a semiconductor chip used as a mark, the second chip region being provided one for each of the plurality of shot regions, the plurality of chips regions other than the second chip region being the first chip regions.

6. The method for manufacturing the semiconductor device according to claim 5 ,

which further comprises, before the exposing, forming a conduction film over the semiconductor wafer; and forming a photoresist film over the conduction film,

in the exposing, the photoresist film is exposed, and

which further comprises, after the exposing, developing the photoresist film; and etching the conduction film with the photoresist film as the mask.

7. The method for manufacturing the semiconductor device according to claim 5 , wherein

a configuration of the first dummy pattern and a configuration of the second dummy pattern are different from each other.

8. The method for manufacturing the semiconductor device according to claim 5 , wherein

an arrangement direction of the first dummy patterns and an arrangement direction of the second dummy patterns are different from each other.

9. The method for manufacturing the semiconductor device according to claim 5 , wherein

the first dummy patterns and the second dummy patterns are formed on an uppermost metal interconnection layer of a plurality of metal interconnection layers.

10. The method for manufacturing the semiconductor device according to claim 5 , wherein

a number of the second pattern region is one, and

the plurality of pattern regions other than the second pattern region are the first pattern regions.

11. A semiconductor wafer comprising:

patterns transferred to a plurality of shot regions of the semiconductor wafer respectively,

a plurality of chip regions being formed in the plurality of shot regions respectively, the plurality of chip regions including first chip regions functioning as ordinary semiconductor chips and a second chip region functioning as a semiconductor chip used as a mark, the second chip region being provided one for each of the plurality of shot regions, the plurality of chips regions other than the second chip region being the first chip regions,

a plurality of first dummy patterns being formed respectively in the first chip region, the plurality of first dummy patterns being arranged repeatedly in a first manner, the first dummy patterns being not electrically connected to any interconnection layers,

a plurality of second dummy patterns being formed respectively in the second chip region, the plurality of second dummy patterns being arranged repeatedly in a second manner different from the first manner, the second dummy patterns being not electrically connected to any interconnection layers, wherein

the second dummy pattern is not formed in the first chip region, and the first dummy patterns is not formed in the second chip region.