Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor device
A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.
1. A phosphor layer attaching kit comprising:
a phosphor layer and
a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package, wherein
a percentage of peel strength of the silicone pressure-sensitive adhesion composition is 30% or more, and is defined as follows:
Percentage of peel strength=[(peel strength PS 75° C. in an atmosphere at 75° C.)/(peel strength PS 25° C. in an atmosphere at 25° C.)]×100;
wherein Peel Strength PS 75° C. in an atmosphere at 75° C.: a peel strength at a temperature of 75° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer, and
Peel Strength PS 25° C. in an atmosphere at 25° C.: a peel strength at a temperature of 25° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer.
2. The phosphor layer attaching kit according to claim 1 , wherein the silicone pressure-sensitive adhesion composition is a silicone pressure-sensitive adhesive composition.
3. The phosphor layer attaching kit according to claim 1 , wherein the silicone pressure-sensitive adhesion composition is a silicone thermoplastic-thermosetting adhesive composition having both thermoplastic properties and thermosetting properties.
4. An optical semiconductor element-phosphor layer attaching body comprising:
an optical semiconductor element,
and a phosphor attaching sheet fabricated from a phosphor layer attaching kit including a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to the optical semiconductor element and allowing the phosphor layer to be attached to the optical semiconductor element via the silicone pressure-sensitive adhesion composition, wherein
a percentage of peel strength of the silicone pressure-sensitive adhesion composition is 30% or more, and is defined as follows:
Percentage of peel strength=[(peel strength PS 75° C. in an atmosphere at 75° C.)/(peel strength PS 25° C. in an atmosphere at 25° C.)]×100;
wherein Peel Strength PS 75° C. in an atmosphere at 75° C.: a peel strength at a temperature of 75° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer, and
Peel Strength PS 25° C. in an atmosphere at 25° C.: a peel strength at a temperature of 25° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer.
5. An optical semiconductor device comprising:
a substrate,
an optical semiconductor element to be mounted on the substrate, and
a phosphor attaching sheet fabricated from a phosphor layer attaching kit according to claim 1 , wherein the phosphor layer is attached to the optical semiconductor element via the silicone pressure-sensitive adhesion composition, wherein
a percentage of peel strength of the silicone pressure-sensitive adhesion composition is 30% or more, and is defined as follows:
Percentage of peel strength=[(peel strength PS 75° C. in an atmosphere at 75° C.)/(peel strength PS 25° C. in an atmosphere at 25° C.)]×100;
wherein Peel Strength PS 75° C. in an atmosphere at 75° C.: a peel strength at a temperature of 75° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer, and
Peel Strength PS 25° C. in an atmosphere at 25° C.: a peel strength at a temperature of 25° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer.
6. An optical semiconductor device comprising:
an optical semiconductor package including a substrate, an optical semiconductor element to be mounted on the substrate, a reflector formed at one side in a thickness direction of the substrate and disposed, when projected in the thickness direction, so as to surround the optical semiconductor element, and an encapsulating layer filling the inside of the reflector and encapsulating the optical semiconductor element and
a phosphor attaching sheet fabricated from a phosphor layer attaching kit according to claim 1 , and the phosphor layer is attached to the one side in the thickness direction of the optical semiconductor package via the silicone pressure-sensitive adhesion composition, wherein
a percentage of the following peel strength of the silicone pressure-sensitive adhesion composition is 30% or more, and is defined as follow:
Percentage of peel strength=[(peel strength PS 75° C. in an atmosphere at 75° C.)/(peel strength PS 25° C. in an atmosphere at 25° C.)]×100;
wherein Peel Strength PS 75° C. in an atmosphere at 75° C.: a peel strength at a temperature of 75° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer, and
Peel Strength PS 25° C. in an atmosphere at 25° C.: a peel strength at a temperature of 25° C. at the time of peeling a support and a pressure-sensitive adhesion layer from the phosphor layer at a peel angle of 180 degrees and a rate of 300 mm/min after attaching the pressure-sensitive adhesion layer formed from the silicone pressure-sensitive adhesion composition and laminated on the support to the phosphor layer.