THIN FILM TRANSISTOR ARRAY AND EL DISPLAY EMPLOYING THEREOF
An EL display has a luminescence unit having a luminescence layer being disposed between the pair of electrodes, and a transistor array unit controlling the luminescence of the luminescence unit. An interlayer insulating film is disposed between the luminescence unit and the transistor array unit. An electrode of the luminescence unit is connected electrically to the transistor array unit via a contact hole provided in the interlayer insulation film. The transistor array unit has a wiring component made of copper or copper alloy. The wiring component has a lower layer pattern made of copper or copper alloy, and an upper layer pattern made of metal material different from that for the lower layer pattern. The upper layer pattern covers the upper surface and the side surface of the lower layer pattern.
1 . An EL display including a luminescence unit having a luminescence layer being disposed between a pair of electrodes, and a thin film transistor (TFT) array unit controlling luminescence of the luminescence unit, wherein an interlayer insulation film is disposed between the luminescence unit and the TFT array unit and an electrode of the luminescence unit is electrically connected with the TFT array unit via a contact hole of the interlayer insulation film,
wherein the TFT array unit has a wiring component made of copper or copper alloy, and
the wiring component includes a lower layer pattern made of copper or copper alloy, and an upper layer pattern made of a metal material different from that for the lower layer pattern and covering an upper surface and a side surface of the lower layer pattern.
2 . The EL display of claim 1 , wherein
the upper layer pattern is made of molybdenum or molybdenum alloy.
3 . A thin film transistor array unit including a current supplying electrode to which an electrode of a luminescence unit is connected via a contact hole formed in an interlayer insulation film disposed between the luminescence unit,
wherein the transistor array unit comprises a wiring component made of copper or copper alloy, and a wiring component comprises a lower layer pattern made of copper or a copper alloy, and an upper layer pattern made of metal material different from that for the lower layer pattern and covers an upper surface and a side surface of the lower layer pattern.
4 . The unit of claim 3 , wherein
the upper layer pattern is made of molybdenum or molybdenum alloy.