IP Library Granted Patent US 9,383,285
Granted Patent B2
US 9,383,285 · App. 14/034,346 · Granted Jul 5, 2016

MEMS resonator pressure sensor

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Quick Facts
Patent No.
US 9,383,285
App. No.
14/034,346
Granted
Jul 5, 2016
Kind
B2
Abstract

A resonant MEMS pressure sensor in which the resonator mass of the MEMS resonator is anchored both to the fixed base beneath the resonator cavity as well as to the top membrane over the resonator cavity. This provides a more robust fixing of the resonator mass and offers a dependence of resonant frequency on the pressure outside the cavity.

Claims (33)

1. A pressure sensor comprising:

a MEMS resonator formed within a cavity,

wherein the cavity comprises a fixed base and a top membrane which deforms in response to the pressure to be sensed,

wherein the resonator has a resonant frequency which is dependent on the incident pressure,

wherein the MEMS resonator comprises a resonator mass that comprises a beam with a first and a second anchor at each end of the beam, and

wherein the first anchors connect to the fixed base and the second anchors connect to the top membrane.

2. A pressure sensor as claimed in claim 1 , wherein the first anchor at one end is on an opposite lateral side of the beam to the first anchor at the other end, and the second anchor at one end is on an opposite lateral side of the beam to the second anchor at the other end.

3. A pressure sensor as claimed in claim 1 , wherein the MEMS resonator comprises a resonator mass formed from a portion of the top silicon layer of a buried oxide substrate arrangement.

4. A pressure sensor as claimed in claim 3 , wherein the fixed base comprises the bottom silicon substrate of the buried oxide substrate arrangement.

5. A pressure sensor as claimed in claim 1 comprising an actuation electrode for actuating the MEMS resonator and a sense electrode for sensing the MEMS resonator oscillations, and a feedback control circuit for sustaining resonator oscillations.

6. A pressure sensor arrangement, comprising:

a pressure sensor as claimed in claim 1 ; and

a reference sensor,

wherein the reference sensor comprises a MEMS resonator formed within a cavity,

wherein the cavity comprises a fixed base and a top membrane which deforms in response to the pressure to be sensed, and

wherein the MEMS resonator comprises a resonator mass which is anchored only to the fixed base.

7. A method of fabricating a pressure sensor, comprising:

forming a MEMS resonator within a cavity,

wherein the cavity comprises a fixed base and a top membrane which deforms in response to the pressure to be sensed, and

wherein the resonator has a resonant frequency which is dependent on the incident pressure; and

anchoring the MEMS resonator having a resonator mass that comprises a beam with a first and a second anchor at each end of the beam by anchoring the first anchors to the fixed base and the second anchors to the top membrane.

8. A method as claimed in claim 7 , comprising forming the resonator mass formed from a portion of the top silicon layer of a buried oxide substrate arrangement.

9. A method as claimed in claim 8 , comprising forming an anchor to the fixed base by a selective etching of the oxide layer of the buried oxide substrate arrangement.

10. A method as claimed in claim 8 , comprising forming an anchor to the top membrane by a selective etching of a sacrificial layer before the sacrificial etching, which un-etched portions of the sacrificial layer form the cavity portion over the resonator mass.

11. A pressure sensor comprising:

a MEMS resonator formed within a cavity,

wherein the cavity comprises a fixed base and a top membrane which deforms in response to the pressure to be sensed,

wherein the resonator has a resonant frequency which is dependent on the incident pressure,

wherein the MEMS resonator comprises a resonator mass which is anchored both to the fixed base and the top membrane, and

wherein the resonator mass comprises a frame with a set of parallel beams extending across the frame and each beam anchored at its middle.

12. A pressure sensor as claimed in claim 11 , wherein there are four parallel beams, with two at one lateral side of the frame and two at the other lateral side of the frame, and

wherein at each lateral side, one beam is anchored to the fixed base and the other is anchored to the top membrane.

13. A pressure sensor as claimed in claim 11 , wherein there is an even number of parallel beams, with half anchored to the fixed base and the other half anchored to the top membrane.

Assignments (13)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: AMS AG; AMS INTERNATIONAL AG; AMS SENSORS UK LIMITED; AMS SENSORS GERMANY GMBH
To: SCIOSENSE B.V.
Reel/Frame 052769/0820 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: NXP B.V.
To: AMS INTERNATIONAL AG
Reel/Frame 036015/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2014
From: LE, KIM PHAN; BESLING, WILLEM FREDERIK ADRIANUS
To: NXP B.V.
Reel/Frame 032301/0071 →