Applications of a reversible dry adhesive system
View Patent ↗One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate. One variation includes a method including using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate during building or reconfiguring a product.
1. A method comprising:
using a reversible dry adhesive system to reversibly couple a first substrate to a second substrate, wherein the reversible dry adhesive system comprises a dry adhesive layer attached to a shape memory polymer layer, and at least one of a backing layer, spring layer, or wire overlying or underlying the shape memory polymer, the spring layer being constructed and arranged to provide stored energy or being contractible to assist in peeling the adhesive layer from the first substrate or second substrate, or prevents opposing surfaces of the shape memory polymer from adhering to each other under load, wherein at least one of the first substrate or second substrate is a component of a handling device, the handling device further comprising one or two side grips, the handling device being constructed and arranged for handling smooth surfaces including parts comprising metal or a polymeric material or ceramic during assembly or repair, or for storage, transportation, or installation of sheets including glass or metal or polymeric materials, or for clamping two objects together during manufacture or repair, or holding an object down or against a surface.
2. A method as set forth in claim 1 wherein the shape memory polymer layer comprises:
at least one of a rigid epoxy or a flexible epoxy; and
at least one of a crosslinking agent or a catalytic curing agent,
wherein the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, or an anhydride.
3. A method as set forth in claim 1 wherein the dry adhesive layer comprises:
at least one of a rigid epoxy or a flexible epoxy; and
at least one of a crosslinking agent or a catalytic curing agent,
wherein the rigid epoxy is an aromatic epoxy having at least two epoxide groups, the flexible epoxy is an aliphatic epoxy having at least two epoxide groups, and the crosslinking agent is one of a multi-amine, an organic multi-carboxylic acid, or an anhydride.