Granted Patent B2

US 9,318,410 · App. 14/037,706 · Granted Apr 19, 2016

Abstract

Claims (24)

1. A microchip die cooling assembly comprising:

a circuit board;

a microchip having an exposed die attached to the circuit board;

a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip;

a heat sink having a bottom side and a top side comprising a cooling structure;

a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader;

a second thermal interface material in contact with the top side of the heatspreader and the bottomside of the heat sink;

a pin connected to the heatspreader and circuit board securing the heatspreader to the circuit board; and

a spring connected to the pin to bias the heatspreader against the microchip.

2. The assembly of claim 1 , wherein the assembly further comprises:

two pins having barbs securing the heatspreader to the circuit board; and

a spring attached to each pin that biases the heatspreader against the microchip.

3. The assembly of claim 1 , wherein the heat sink is made of copper, zinc, aluminum, or a zamak alloy.

4. The assembly of claim 1 , wherein the heat sink forms an outer wall of an enclosure which holds the circuit board.

5. The assembly of claim 1 , wherein the heatspreader is made of copper or aluminum.

6. The assembly of claim 1 , wherein the first thermal interface material is thermal grease or a phase change material.

7. The assembly of claim 1 , wherein the second thermal interface material is a gap pad or thermal gel.

8. The assembly of claim 1 , wherein the assembly is a passive cooling system.

9. A heatspreader for use in an assembly for cooling a microchip with an exposed chip die, comprising:

a body that formed from a thermally conductive material;

a planar bottom surface having an area significantly greater than the area of the exposed chip die for thermally connecting to the exposed chip die;

a planar top surface having an area equal to the area of the planar bottom surface; and

two mounting features extending outward from each other in opposition in a plane parallel to the bottom surface for mounting the heatspreader in a resiliently biased thermal connection with the exposed chip die, wherein the resilient biased thermal connection includes a pin extending between the heatspreader and a circuit board to bias the heatspreader.

10. The heatspreader of claim 9 , wherein the thermally conductive material is one of copper or aluminum.

Assignments (12)