Slow wave inductive structure and method of forming the same
View Patent ↗A slow wave inductive structure includes a first substrate, a first conductive winding over the first substrate, and a second substrate over the first substrate. The second substrate has a thickness ranging from about 50 nanometers (nm) to about 150 nm. A distance between the first conductive winding and the second substrate ranges from about 1 micron (μm) to about 2 μm. A slow wave inductor includes a first substrate and a first conductive winding over the first substrate. The slow wave inductor further includes a second substrate over the first substrate and a plurality of switches in the second conductive substrate. The first conductive winding is connected to each switch of the plurality of switches.
1. A slow wave inductive structure comprising: a first substrate;
a first conductive winding over the first substrate; and
a second substrate over the first substrate, the second substrate having a thickness ranging from about 50 nanometers (nm) to about 150 nm, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (μm) to about 2 μm, wherein a second conductive winding on an opposite side of the second substrate from the first conductive winding and the second substrate comprises polysilicon or doped silicon.
2. The slow wave inductive structure of claim 1 , wherein the first conductive winding is between the first substrate and the second substrate.
3. The slow wave inductive structure of claim 1 , wherein a distance from the second conductive winding to the second substrate ranges from about 1 μm to about 2 μm.
4. The slow wave inductive structure of claim 1 , further comprising an inter level via (ILV) configured to electrically connect the first conductive winding to the second conductive winding through the second substrate.
5. The slow wave inductive structure of claim 1 , further comprising at least one switch in the second substrate, wherein the at least one switch is configured to selectively connect the first conductive winding to the second conductive winding.
6. The slow wave inductive structure of claim 1 , wherein the first conductive winding is electrically disconnected from the second conductive winding.
7. The slow wave inductive structure of claim 1 , further comprising:
a first inter metal dielectric (IMD) layer between the first substrate and the second substrate; and
a second IMD layer over the second substrate, wherein the first conductive winding is in the first IMD layer or the second IMD layer.
8. A slow wave inductor comprising:
a first substrate;
a first conductive winding over the first substrate;
a second substrate over the first substrate, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (μm) to about 2 μm; and
a plurality of switches in the second substrate, wherein the first conductive winding is connected to at least one switch of the plurality of switches.
9. The slow wave inductor of claim 8 , wherein the second substrate having a thickness ranging from about 50 nanometers (nm) to about 150 nm.
10. The slow wave inductor of claim 8 , further comprising a second conductive winding on an opposite side of the second substrate from the first conductive winding, wherein the second conductive winding is connected to each switch of the plurality of switches.
11. The slow wave inductor of claim 10 , wherein at least one switch of the plurality of switches is configured to introduce a negative mutual inductance in the slow wave inductor.
12. The slow wave inductor of claim 10 , wherein the second conductive winding comprises an input port, the first conductive winding comprises an output port, and at least one switch of the plurality of switches is configured to allow a current to pass from the input port to the output port.
13. The slow wave inductor of claim 10 , further comprising an inter level via (ILV) configured to electrically connect the first conductive winding to the second conductive winding.
14. A slow wave inductive structure comprising:
a first substrate;
a first conductive winding over the first substrate;
a second substrate over the first substrate, the second substrate having a thickness ranging from about 50 nanometers (nm) to about 150 nm; and
a second conductive winding over the second substrate, wherein the first conductive winding is configured to be selectively connected to the second conductive winding.
15. The slow wave inductive structure of claim 14 , further comprising at least one switch configured to electrically connect the first conductive winding to the second conductive winding.
16. The slow wave inductive structure of claim 14 , wherein the first winding is in an inter metal dielectric (IMD) layer over the first substrate, and the second winding is a second IMD layer over the second substrate.
17. The slow wave inductive structure of claim 14 , further comprising at least one conductive element electrically connecting the first winding to the second winding, wherein the at least one conductive element comprises a through silicon via (TSV), an inter-level via (ILV), or a metal line.