IP Library Patent Application 14039406
Patent Application
App. No. 14/039,406

ALUMINUM POLY(ARYL ETHER KETONE) LAMINATE, METHODS OF MANUFACTURE THEREOF, AND ARTICLES COMPRISING THE SAME

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Patent No.
US None
App. No.
14/039,406
Abstract

A laminate having excellent bond strength, and comprising a tempered aluminum layer comprising aluminum in an amount of 95 to less than 99 wt %, and at least one of cobalt, copper, lithium, magnesium, manganese, nickel, platinum, and silicon in a total amount of at least 0.5 wt %; and a poly(aryl ether ketone) layer, wherein at least a portion layer and the poly(aryl ether ketone) layer are in direct contact.

Claims (36)

1 . A laminate comprising:

a tempered aluminum layer comprising aluminum in an amount of 95 to less than 99 wt %, and at least one of cobalt, copper, lithium, magnesium, manganese, nickel, platinum, and silicon in a total amount of at least 0.5 wt %; and

a poly(aryl ether ketone) layer, wherein at least a portion layer and the poly(aryl ether ketone) layer are in direct contact.

2 . The laminate of claim 1 , wherein the tempered aluminum layer comprises aluminum in an amount of at least 98 wt %, and silicon and iron in a total amount of at least 0.5 wt %.

3 . The laminate of claim 2 , wherein the aluminum is tempered to a designation of H1.

4 . The laminate of claim 3 , wherein the aluminum is tempered to a designation of H18.

5 . The laminate of any one of claim 2 , wherein the aluminum comprises

98 to 99.49 wt % of aluminum,

0.50 to 1.5 wt % of iron, and

0.01 to 0.50 wt % of silicon.

6 . The laminate of claim 5 , wherein the aluminum comprises

98.1 to 99.39 wt % of aluminum,

0.60 to 1.5 wt % of iron, and

0.02 to 0.40 wt % of silicon.

7 . The laminate of claim 6 , wherein the aluminum comprises

98.40 to 99.25 wt % of aluminum,

0.70 to 1.3 wt % of iron, and

0.05 to 0.30 wt % of silicon.

8 . The laminate of claim 7 , wherein the aluminum further comprises other elements in a total amount of less than or equal to 0.25 wt %.

9 . The laminate of claim 8 , wherein the aluminum further comprises less than or equal to 0.05 wt % of copper, less than or equal to 0.0003 wt % of magnesium, and less than or equal to 0.05 wt % of titanium.

10 . The laminate of claim 2 , wherein the aluminum is tempered Aluminum 8079 with the tempering designation H18.

11 . The laminate of claim 1 , wherein the poly 1 (aryl ether ketone) is poly(ether ether ketone).

12 . The laminate of claim 1 , wherein the poly(aryl ether ketone) layer further comprises a particulate filler in an amount of 1 to 80 wt %, based on the total weight of the poly(aryl ether ketone) layer.

13 . The laminate of claim 12 , wherein the particulate filler is a talc.

14 . The laminate of claim 1 , wherein the poly(aryl ether ketone) layer further comprises a glass fiber reinforcement.

15 . A method of manufacturing a laminate, the method comprising:

directly contacting a least portion of a tempered aluminum layer comprising aluminum in an amount of 95 to less than 99 wt %, and at least one of cobalt, copper, lithium, magnesium, manganese, nickel, platinum, and silicon in a total amount of at least 0.5 wt %, with at least a portion of a poly(aryl ether ketone) layer; and

heat-bonding the aluminum layer and the poly(aryl ether ketone) layer under conditions effective to manufacture the laminate.

16 . The method of claim 15 , wherein the aluminum comprises aluminum in an amount of at least 98 wt %, and silicon and iron in a total amount of at least 0.5 wt %.

17 . The method of claim 15 , wherein the aluminum comprises

98.40 to 99.25 wt % of aluminum,

0.70 to 1.3 wt % of iron, and

0.05 to 0.30 wt % of silicon

18 . The method of claim 17 , wherein the aluminum is tempered Aluminum 8079, tempered to a designation of H18.

19 . The method of claim 15 , wherein the heat bonding is at 200 to 450° C. while compressing under a pressure of 2 to 10 megaPascals.

20 . An article comprising the laminate of claim 1 .

Assignments (4)
SECURITY INTEREST Recorded Feb 20, 2017
From: ROGERS CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041757/0748 →
SECURITY INTEREST Recorded Jun 26, 2015
From: ROGERS CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 035985/0332 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S DATE OF SIGNATURE PREVIOUSLY RECORDED ON REEL 031443 FRAME 0952. ASSIGNOR(S) HEREBY CONFIRMS THE RE-RECORDED ASSIGNMENT CORRECTS THE ASSIGNEE'S SIGNATURE DATE FROM 10/10/2003 TO 10/10/2013. Recorded Dec 6, 2013
From: RYNIERS, FILIP PAUL KAREL
To: ROGERS CORPORATION
Reel/Frame 031768/0407 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2013
From: RYNIERS, FILIP PAUL KAREL
To: ROGERS CORPORATION
Reel/Frame 031443/0952 →