Substrate treatment method and substrate treatment apparatus
A substrate treatment method includes a rinsing step of supplying a rinse liquid to a front surface of a substrate while rotating the substrate at a first rotation speed, a liquid mixture film forming step of forming a liquid film of a liquid mixture of water and an organic solvent having a smaller surface tension than the water on the front surface after the rinsing step by supplying the water and the organic solvent to the front surface while reducing the rotation speed of the substrate from the first rotation speed to a second rotation speed lower than the first rotation speed, and an organic solvent replacing step of replacing the liquid mixture supplied to the front surface with the organic solvent after the liquid mixture film forming step by supplying the organic solvent to the front surface.
1. A substrate treatment method comprising:
a water rinsing step of supplying a rinse liquid, which is a deionized water, to a front surface of a substrate held by a substrate holding unit while rotating the substrate at a first rotation speed such that the rinse liquid spreads over the entire front surface of the substrate;
a liquid mixture film forming step of forming a liquid film of a liquid mixture of water and an isopropyl alcohol having a smaller surface tension than the water on the entire front surface of the substrate held by the substrate holding unit after the water rinsing step by supplying the water and the isopropyl alcohol to the entire front surface of the substrate while reducing the rotation speed of the substrate from the first rotation speed to a second rotation speed that is lower than the first rotation speed, wherein a mixing ratio of the isopropyl alcohol to the water ranges, by weight, from 5% to 10%; and
an isopropyl alcohol replacing step of replacing the liquid mixture supplied to the front surface of the substrate held by the substrate holding unit in the liquid mixture film forming step with the isopropyl alcohol after the liquid mixture film forming step by supplying the isopropyl alcohol to the front surface of the substrate.
2. The substrate treatment method according to claim 1 , wherein the supply of the water and the isopropyl alcohol in the liquid mixture film forming step is started before the deceleration of the substrate from the first rotation speed is started.
3. The substrate treatment method according to claim 1 , wherein the liquid mixture film forming step includes the step of reducing the rotation speed of the substrate held by the substrate holding unit in a plurality of stages including at least three stages.
4. The substrate treatment method according to claim 1 , wherein the isopropyl alcohol replacing step includes a step of rotating the substrate held by the substrate holding unit at a third rotation speed that is higher than the second rotation speed.
5. The substrate treatment method according to claim 1 , wherein the front surface of the substrate held by the substrate holding unit is at least partially hydrophobic.
6. The substrate treatment method according to claim 1 , further comprising a heating step of supplying a back surface of the substrate with a warm water having a temperature higher than that of the isopropyl alcohol present on the front surface of the substrate simultaneously the isopropyl alcohol replacing step.