Firing metal with support
View Patent ↗A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a paste, a first metal, and a first conductive portion that includes a conductive alloy formed from the first metal at an interface of the substrate and the semiconductor region.
1. A method of fabricating a solar cell, the method comprising:
forming a paste on a silicon substrate;
depositing nickel on the paste;
firing the nickel to form a plurality of discontinuous conductive portions that electrically couples the nickel to the silicon substrate and alloys the paste, nickel and silicon substrate at an interface of the substrate; and
forming a conductive contact that includes one of the plurality of conductive portions for the solar cell.
2. The method of claim 1 , further comprising:
before said depositing the nickel, firing the paste to form a second conductive portion that electrically couples the paste to the silicon substrate, wherein the conductive contact also includes the second conductive portion.
3. The method of claim 1 , wherein said forming the conductive contact includes electroplating copper on the nickel.
4. The method of claim 1 , wherein said forming the paste includes printing a conductive paste.
5. The method of claim 1 , wherein said forming the paste includes printing particles that include aluminum.
6. The method of claim 1 , wherein said firing the nickel to form the first conductive portion also electrically couples the paste to the silicon substrate.
7. A method of fabricating a solar cell, comprising:
depositing a paste on a semiconductor region disposed in or above a silicon substrate;
plating a first metal on the paste;
forming a conductive alloy from the first metal, paste and the silicon substrate by firing;
plating a second metal on the first metal, wherein the first and second metals and the conductive alloy form a conductive contact for the semiconductor region of the solar cell;
where the firing step forms a plurality of discontinuous conductive alloy portions.
8. The method of claim 7 , further comprising:
before said plating the first metal on the paste, forming another conductive alloy from the paste and the silicon substrate, wherein the conductive contact is also formed from said another conductive alloy.
9. The method of claim 7 , wherein said depositing the paste includes printing particles of a conductive paste in a pre-determined finger pattern.
10. The method of claim 7 , wherein said plating the first metal includes electrolessly plating nickel on the paste.
11. The method of claim 7 , wherein said forming the conductive alloy includes heating nickel to form nickel silicide.