Photoelectric conversion device and method for producing photoelectric conversion device
View Patent ↗In this method for producing a photoelectric conversion device: an i-type non-crystalline layer and an n-type non-crystalline layer comprising a non-crystalline semiconductor film are formed on the light-receiving surface of a semiconductor substrate; an i-type non-crystalline layer and an n-type non-crystalline layer comprising a non-crystalline semiconductor film are formed on the back surface of the semiconductor substrate; a protective layer is formed on the n-type non-crystalline layer; an insulating layer is formed on the n-type non-crystalline layer; and in the state where the top of the n-type non-crystalline layer is covered by the protective layer, patterning is performed by eliminating a portion of the i-type non-crystalline layer, the n-type non-crystalline layer, and the insulating layer.
1. A method for producing a photoelectric conversion device, comprising:
a first step comprising forming a first passivation layer on a first surface of a semiconductor substrate, the first passivation layer being composed of a non-crystalline semiconductor film;
a second step comprising forming a second passivation layer on a second surface of the semiconductor substrate, the second passivation layer being composed of a non-crystalline semiconductor film, the second surface being opposite to the first surface;
a third step comprising forming a protective layer on the first passivation layer;
a fourth step comprising forming an insulating layer on the second passivation layer; and
a fifth step comprising performing patterning so as to eliminate a portion of the second passivation layer and a portion of the insulating layer, in such a state that the first passivation layer is covered with the protective layer;
a sixth step comprising cleaning the surface of the semiconductor substrate and simultaneously eliminating the protective layer after the fifth step, the surface of the semiconductor being exposed by eliminating the second passivation layer and the insulating layer in the firth step; and
a seventh step comprising forming an antireflective layer on the first passivation layer in the same manner as in the third step, after the sixth step.
2. The method for producing the photoelectric conversion device according to claim 1 ,
wherein a cleaning liquid used in the sixth step has an etching rate to the protective layer which is higher than an etching rate to the insulating layer.
3. The method for producing the photoelectric conversion device according to claim 1 ,
wherein the protective layer is composed of any one of silicon nitride, silicon oxide and silicon oxynitride.
4. The method for producing the photoelectric conversion device according to claim 1 ,
wherein the protective layer and the insulating layer are composed of a silicon nitride film, and
the protective layer comprises a layer whose etching rate is higher than an etching rate of the insulating layer to an etchant containing hydrogen fluoride.
5. The method for producing the photoelectric conversion device according to claim 1 ,
wherein the protective layer and the insulating layer are composed of a silicon nitride film, and
the protective layer comprises a layer whose hydrogen content ratio is higher than a hydrogen content ratio of the insulating layer.
6. The method for producing the photoelectric conversion device according to claim 1 ,
wherein the protective layer and the insulating layer are composed of a silicon nitride film, and
the protective layer comprises a layer whose silicon content ratio is lower than a silicon content ratio of the insulating layer.
7. The method for producing the photoelectric conversion device according to claim 1 ,
wherein the protective layer and the insulating layer are composed of a silicon nitride film, and
the protective layer comprises a layer whose density is lower than a density of the insulating layer.
8. The method for producing the photoelectric conversion device according to claim 1 ,
wherein a film-forming temperature for the insulating layer in the fourth step is higher than a film-forming temperature for the protective layer in third the step.
9. The method for producing the photoelectric conversion device according to claim 1 ,
wherein in the third step, the protective layer is formed by a plasma-enhanced chemical vapor deposition method, and
in the fourth step, the insulating layer is formed by a sputtering method.
10. The method for producing the photoelectric conversion device according to claim 1 , wherein in the third step, the protective layer is formed by a plasma-enhanced chemical vapor deposition method, and
in the fourth step, the insulating layer is formed by a plasma-enhanced chemical vapor deposition method at a higher plasma density than in the third step.