Pre-heating for reduced subthreshold leakage
View Patent ↗Certain semiconductor processes provide for the use of multiple different types of transistors with different threshold voltages in a single IC. It can be shown that in certain ones of these semiconductor processes, the speed at which high threshold transistors can operate at decreases with decreasing temperature. Thus, the overall processing speed of an IC that implements high threshold transistors is often limited by the lowest temperature at which the IC is designed (or guaranteed) to properly function. Embodiments of a system and method that overcome this deficiency by “pre-heating” the IC (or at least portions of the IC that implement the high threshold transistors) such that the IC can operate at a frequency (once pre-heated) higher than what would otherwise be possible for a given, minimum temperature at which the IC is designed (or guaranteed) to properly function at are provided.
1. A system comprising:
a variable frequency oscillator configured to generate a clock signal to clock a sequential logic block; and
a pre-heating controller configured to:
reduce a frequency of the clock signal if a temperature associated with the sequential logic block is determined to be below a particular temperature, and
pre-heat the sequential logic block if the temperature associated with the sequential logic block is determined to be below the particular temperature.
2. The system of claim 1 , wherein the sequential logic block comprises a first device that has an operating speed that decreases with decreasing temperature of the first device.
3. The system of claim 2 , wherein the sequential logic block comprises a storage element configured to store a logic value produced at least in part by the first device.
4. The system of claim 2 , wherein the first device is configured to form an inversion layer at a first threshold voltage and is implemented on an integrated circuit with a second device, the second device configured to form an inversion layer at a second threshold voltage that is less than the first threshold voltage.
5. The system of claim 4 , wherein the first device and the second device are transistors.
6. The system of claim 1 , further comprising:
a temperature sensor configured to sense the temperature associated with the sequential logic block.
7. The system of claim 1 , wherein the pre-heating controller is configured to determine whether the temperature associated with the sequential logic block is below or above the particular temperature based on a number of clock cycles of the clock signal that have elapsed.
8. The system of claim 1 , wherein the pre-heating controller is configured to determine whether the temperature associated with the sequential logic block is below or above the particular temperature based on an amount of energy consumed by one or more logic blocks associated with the sequential logic block.
9. A method comprising:
generating a clock signal having a nominal operating frequency to clock a sequential logic block; and
setting a frequency of the clock signal below the nominal operating frequency based on a temperature associated with the sequential logic block being below a particular temperature.
10. The method of claim 9 , wherein the sequential logic block comprises a first device that has an operating speed that decreases with decreasing temperature of the first device.
11. The method of claim 10 , wherein the sequential logic block comprises a storage element configured to store a logic value produced at least in part by the first device.
12. The method of claim 10 , wherein the first device is configured to form an inversion layer at a first threshold voltage and is implemented on an integrated circuit with a second device, the second device configured to form an inversion layer at a second threshold voltage that is less than the first threshold voltage.
13. The method of claim 12 , wherein the first device and the second device are transistors.
14. The method of claim 9 , further comprising:
sensing the temperature associated with the sequential logic block.
15. The method of claim 9 , further comprising:
determining whether the temperature associated with the sequential logic block is below or above the particular temperature based on a number of clock cycles of the clock signal that have elapsed.
16. The method of claim 9 , further comprising:
determining whether the temperature associated with the sequential logic block is below or above the particular temperature based on an amount of energy consumed by one or more logic blocks associated with the sequential logic block.
17. A system comprising:
a variable frequency oscillator configured to generate a clock signal to clock a sequential logic block; and
a pre-heating controller configured to:
set a frequency of the clock signal below a nominal operating frequency based on a temperature associated with the sequential logic block being below a particular temperature, and
pre-heat the sequential logic block based on the temperature associated with the sequential logic block being below the particular temperature.
18. The system of claim 17 , wherein the sequential logic block comprises a first device that has an operating speed that decreases with decreasing temperature of the first device.
19. The system of claim 18 , wherein the sequential logic block comprises a storage element configured to store a logic value produced at least in part by the first device.