Manufacturing method of an active device substrate
An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.
1. A manufacturing method of an active device substrate, comprising:
providing a supporting plate;
forming an organic de-bonding layer on the supporting plate;
forming an inorganic de-bonding layer on the organic de-bonding layer, wherein the material of the inorganic de-bonding layer is metal, metal oxide, or a combination thereof;
forming a flexible substrate on the inorganic de-bonding layer, wherein a surface of the flexible substrate adjacent to the inorganic de-bonding layer is a flat surface;
forming at least one active device on or above the flexible substrate;
cutting the flexible substrate and the inorganic de-bonding layer to form a stack structure which is formed by the inorganic de-bonding layer, the flexible substrate and the active device; and
separating the organic de-bonding layer and the inorganic de-bonding layer.
2. The manufacturing method of claim 1 , further comprising:
cutting the organic de-bonding layer.
3. The manufacturing method of claim 1 , wherein the step of forming the organic de-bonding layer is performed by physical vapor deposition (PVD), chemical vapor deposition (CVD), spin coating, spray coating, plasma modification, or printing, wherein the material of the organic de-bonding layer is parylene, silane, siloxane, organofluorine, FAS, or a combination thereof, wherein the step of forming the inorganic de-bonding layer is performed by PVD, CVD, or sputtering, and the manufacturing method further comprises:
thermal annealing the organic de-bonding layer before forming the inorganic de-bonding layer.
4. A manufacturing method of a display device, comprising:
the manufacturing method of an active device substrate of claim 1 ; and
forming at least one display element on the at least one active device.
5. The manufacturing method of claim 4 , wherein the flexible substrate and the inorganic de-bonding layer are cut to separate the organic de-bonding layer and the inorganic de-bonding layer before the step of forming the at least one display element on the at least one active device.
6. The manufacturing method of claim 4 , wherein the flexible substrate and the inorganic de-bonding layer are cut to separate the organic de-bonding layer and the inorganic de-bonding layer after the step of forming the at least one display element on the at least one active device.