Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint
View Patent ↗A method and apparatus for adjusting circuit operation in response to physical orientation of an integrated circuit (IC) coupled to a host site via direct soldering or a socket. The IC can be installed in a correct orientation or rotated and installed in an incorrect orientation. The IC may have a square, substantially symmetric footprint and the incorrect orientation may correspond to 90 or 180 degree rotation of the IC from the correct orientation. The orientations may be discerned by sensing electrical characteristics of the installed IC. For example, the IC may ground a detection line when installed in the correct orientation, while the detection line may be floating when the IC is installed in an incorrect orientation. The IC may be switchably connected to other components such as a power supply only when it is detected as being installed in the correct orientation.
1. An electrical keying apparatus for an integrated circuit, the apparatus comprising:
a. a detection module configured to monitor electrical conditions at a host site and to electrically differentiate between a correct orientation and an incorrect orientation of the integrated circuit when said integrated circuit is coupled to the host site, the incorrect orientation corresponding to rotation of the integrated circuit relative to the correct orientation; and
b. a switching module configured to electrically connect the integrated circuit and host circuitry when the detection module determines that the integrated circuit is in the correct orientation and inhibit electrical connection between the integrated circuit and host circuitry when the integrated circuit is in an incorrect orientation thereby protecting the integrated circuit when the integrated circuit is incorrectly oriented.
2. The apparatus according to claim 1 , wherein in the correct orientation electrical contacts of the integrated circuit align with electrical contacts of the host site in a correct correspondence, and in the incorrect orientation said electrical contacts of the integrated circuit align with said electrical contacts of the host site in an incorrect correspondence.
3. The apparatus according to claim 1 , wherein, in the correct orientation, a first electrical condition is present at one or more predetermined electrical contacts of the host site due to electrical connection with one or more corresponding predetermined electrical contacts of the integrated circuit, and wherein, in the incorrect orientation, a different electrical condition is present at said one or more predetermined electrical contacts of the host site, and wherein the detection module is configured to differentiate between the correct orientation and the incorrect orientation by differentiating between the first electrical condition and the different electrical condition.
4. The apparatus according to claim 3 , wherein the first electrical condition is a ground condition and the different electrical condition is an open circuit condition.
5. The apparatus according to claim 3 , wherein the different electrical condition is an open circuit condition, and wherein the integrated circuit includes an asymmetric footprint which presents one of the corresponding predetermined electrical contacts of the integrated circuit for electrical connection with one of the predetermined electrical contacts of the host site when in the correct orientation, the asymmetric footprint further configured to present a portion of the integrated circuit devoid of electrical contacts to said one of the predetermined electrical contacts of the host site when in the incorrect orientation.
6. The apparatus according to claim 1 , wherein, in the correct orientation, a first electrical condition is present at one or more predetermined electrical contacts of the integrated circuit due to electrical connection with corresponding predetermined electrical contacts of the host site, and wherein, in the incorrect orientation, a different electrical condition is present at said one or more predetermined electrical contacts of the integrated circuit due to electrical connection with different electrical contacts of the host site, and wherein the detection module is configured to differentiate between the correct orientation and the incorrect orientation by differentiating between the first electrical condition and the different electrical condition.
7. The apparatus according to claim 1 , wherein the electrical contacts of the integrated circuit are arranged having a square footprint, and wherein the integrated circuit is capable of coupling to the host site in three incorrect orientations corresponding to: 90 degree rotation from the correct orientation; 180 degree rotation from the correct orientation; and 270 degree rotation from the correct orientation.
8. The apparatus according to claim 1 , wherein the electrical contacts of the integrated circuit are arranged having a rectangular footprint, and wherein the integrated circuit is capable of coupling to the host site in the incorrect orientation corresponding to 180 degree rotation from the correct orientation.
9. The apparatus according to claim 1 , wherein the switching module is configured to switchably complete: an electrical power connection to the integrated circuit, a signal connection to the integrated circuit, a signal connection from the integrated circuit, an electrical power connection to another component associated with the integrated circuit, a signal connection with another component associated with the integrated circuit, or a combination thereof.
10. The apparatus according to claim 1 , further comprising an annunciation circuit configured to indicate orientation of the integrated circuit to a user.
11. The apparatus according to claim 1 , wherein the host site is a socket configured to receive the integrated circuit or a set of printed circuit board lands configured to receive the integrated circuit by soldering.
12. A method for adjusting operation in response to physical orientation of an integrated circuit coupled to a host site, the method comprising:
a. monitoring electrical conditions at the host site;
b. electrically differentiating between a correct orientation and an incorrect orientation, respectively, of the integrated circuit when coupled to the host site, the incorrect orientation corresponding to rotation of the integrated circuit relative to the correct orientation; and
c. allowing electrical connection between the integrated circuit and host circuitry upon making a determination that the integrated circuit is in the correct orientation and inhibiting electrical connection between the integrated circuit and host site when the integrated circuit is in an incorrect orientation thereby protecting the integrated circuit when the integrated circuit is incorrectly oriented.
13. The method according to claim 12 , wherein in the correct orientation electrical contacts of the integrated circuit align with electrical contacts of the host site in a correct correspondence, and in the incorrect orientation said electrical contacts of the integrated circuit align with said electrical contacts of the host site in an incorrect correspondence.
14. The method according to claim 12 , wherein, in the correct orientation, a first electrical condition is present at one or more predetermined electrical contacts of the host site due to electrical connection with one or more corresponding predetermined electrical contacts of the integrated circuit, and wherein, in the incorrect orientation, a different electrical condition is present at said one or more predetermined electrical contacts of the host site, and wherein the method further comprises differentiating between the correct orientation and the incorrect orientation by differentiating between the first electrical condition and the different electrical condition.
15. The method according to claim 14 , wherein the first electrical condition is a ground condition and the different electrical condition is an open circuit condition.
16. The method according to claim 14 , wherein the different electrical condition is an open circuit condition, and wherein the integrated circuit includes an asymmetric footprint which presents one of the corresponding predetermined electrical contacts of the integrated circuit for electrical connection with one of the predetermined electrical contacts of the host site when in the correct orientation, the asymmetric footprint further configured to present a portion of the integrated circuit devoid of electrical contacts to said one of the predetermined electrical contacts of the host site when in the incorrect orientation.
17. The method according to claim 12 , wherein, in the correct orientation, a first electrical condition is present at one or more predetermined electrical contacts of the integrated circuit due to electrical connection with corresponding predetermined electrical contacts of the host site, and wherein, in the incorrect orientation, a different electrical condition is present at said one or more predetermined electrical contacts of the integrated circuit due to electrical connection with different electrical contacts of the host site, and wherein the method further comprises differentiating between the correct orientation and the incorrect orientation by differentiating between the first electrical condition and the different electrical condition.
18. The method according to claim 12 , wherein the electrical contacts of the integrated circuit are arranged having a square footprint, and wherein the integrated circuit is capable of coupling to the host site in three incorrect orientations corresponding to: 90 degree rotation from the correct orientation; 180 degree rotation from the correct orientation; and 270 degree rotation from the correct orientation.
19. The method according to claim 12 , wherein the electrical contacts of the integrated circuit are arranged having a rectangular footprint, and wherein the integrated circuit is capable of coupling to the host site in the incorrect orientation corresponding to 180 degree rotation from the correct orientation.
20. The method according to claim 12 , further comprising switchably completing an electrical power connection to: the integrated circuit, a signal connection to the integrated circuit, a signal connection from the integrated circuit, an electrical power connection to another component associated with the integrated circuit, a signal connection with another component associated with the integrated circuit, or a combination thereof.
21. The method according to claim 12 , further comprising indicating orientation of the integrated circuit to a user.
22. The method according to claim 12 , wherein the host site is a socket configured to receive the integrated circuit or a set of printed circuit board lands configured to receive the integrated circuit by soldering.