MOUNTING SOLUTION FOR COMPONENTS ON A VERY FINE PITCH ARRAY
Various exemplary embodiments relate to a printed circuit board (PCB) comprising a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern; through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads; a solder mask covering the via pad with an opening; a solder pad within said opening electrically connected to said via pad; and a two-lead component attached to said solder pad.
1 . A printed circuit board (PCB) comprising:
a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern;
through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads;
a solder mask covering the via pad with an opening;
a solder pad within said opening electrically connected to said via pad; and
a two-lead component attached to said solder pad.
2 . The PCB of claim 1 , wherein the grid pattern is square.
3 . The PCB of claim 2 , wherein the grid pattern has 0.65 mm pitch.
4 . The PCB of claim 1 , wherein the grid pattern is substantially rectangular.
5 . The PCB of claim 1 , wherein said solder pad is substantially rectangular.
6 . The PCB of claim 1 , wherein the two-lead component is an Imperial 0201 component.
7 . The PCB of claim 6 , wherein the Imperial 0201 component is a discrete component.
8 . The PCB of claim 1 , wherein the opening is substantially rectangular and has contact with the via pad on all four perimeter edges.
9 . A method of manufacturing a PCB comprising the steps of:
selecting two adjacent through-hole vias on a printed circuit board (PCB),
wherein each via has a corresponding via pad, and
wherein the PCB has a ball grid array (BGA) of BGA pads on one side of the PCB arranged in a grid pattern;
covering each via with a respective solder mask;
removing areas from said solder masks,
wherein the areas overlap the holes of the respective through-hole vias;
placing solder pads in said areas; and
attaching a two-lead component to said two adjacent through-hole vias using said solder pads.
10 . The method of claim 9 , wherein the grid pattern is square.
11 . The method of claim 10 , wherein the grid pattern has 0.65 mm pitch.
12 . The method of claim 9 , wherein the grid pattern is substantially rectangular.
13 . The method of claim 12 , wherein the two adjacent through-hole vias are 0.65 mm apart, center to center.
14 . The method of claim 9 , wherein said solder pad is substantially rectangular.
15 . The method of claim 9 , wherein the two-lead component is an Imperial 0201 component.
16 . The method of claim 15 , wherein the Imperial 0201 component is a discrete component.
17 . The method of claim 9 , wherein the areas are substantially rectangular and each edge makes contact with the corresponding via pad.
18 . A computer aided design tool implemented on a computing device for accommodating a two-lead component on in a 0.65 mm by 0.65 mm pitch ball grid array (BGA) printed circuit board (PCB) comprising:
a design tool mode configured to select two adjacent through-hole vias on the printed circuit board (PCB) for connection to a two-lead component
a design tool mode configured to identify a placement of solder pads and shape of solder pads on the two adjacent through-hole vias,
wherein the placement allows a two-lead component to connect to two adjacent through-hole vias, and
wherein the solder pads overlap the holes of the respective through-hole vias.