Apparatus for Dissipating Heat
An apparatus for dissipating heat includes a plate or pipe made of a planar thermal conductive material, such as pyrolytic graphite. The apparatus may include fins attached to the plate or pipe, and the fins can be made of the same or different material as the plate or pipe.
1 . An apparatus for dissipating heat, the apparatus comprising:
a plate made of a planar thermal conductive material, the plate including a top layer and a bottom layer, each of the top and bottom layers oriented in an x-direction and a y-direction coplanar with the x-direction, there being at least one fluid passageway formed through the plate and disposed between the top layer and the bottom layer, the at least one fluid passageway configured to transport a fluid.
2 . The apparatus of claim 1 , wherein the top layer is made of the planar thermal conductive material.
3 . The apparatus of claim 1 , wherein the bottom layer is made of the planar thermal conductive material.
4 . The apparatus of claim 1 , wherein the plate includes an intermediate layer between the top layer and the bottom layer, the intermediate layer is made of the planar thermal conductive material, and the at least one fluid passageway extends through the intermediate layer.
5 . The apparatus of claim 1 , wherein the planar thermal conductive material is pyrolytic graphite.
6 . The apparatus of claim 1 , further comprising fins on the plate.
7 . The apparatus of claim 1 , wherein the at least one fluid passageway is oriented in the y-direction, the plate has a first thermal conductivity in the x-direction and the y-direction, the plate has a second thermal conductivity in a z-direction perpendicular to the x-direction and the y-direction, and the first thermal conductivity is at least 100 times the second thermal conductivity.
8 . The apparatus of claim 1 , wherein the at least one fluid passageway is oriented in the y-direction, the plate has a first thermal conductivity in the y-direction and a z-direction perpendicular to the x-direction and the y-direction, the plate has a second thermal conductivity in the x-direction, and the first thermal conductivity is at least 100 times the second thermal conductivity.
9 . The apparatus of claim 1 , wherein the at least one fluid passageway is oriented in the y-direction, the plate has a first thermal conductivity in the x-direction and a z-direction perpendicular to the x-direction and the y-direction, the plate has a second thermal conductivity in the y-direction, and the first thermal conductivity is at least 100 times the second thermal conductivity.
10 . The apparatus of claim 1 , further comprising a heat source thermally coupled to the top layer of the plate or the bottom layer of the plate.
11 . The apparatus of claim 10 , further comprising a thermal bridge between the plate and the heat source, the thermal bridge being any combination of one or more of a heat sink, a heat spreader, a printed circuit board, a standoff, and a rail.
12 . The apparatus of claim 10 , wherein the heat source is an electronic component capable of generating heat.
13 . The apparatus of claim 1 , further comprising a pump attached to the plate and configured to pump fluid through the least one fluid passageway.
14 . An apparatus for dissipating heat, the apparatus comprising:
a pipe configured to transport a fluid and made of pyrolytic graphite; and
a plurality of fins on the pipe, each fin configured to dissipate heat from the pipe.
15 . The apparatus of claim 14 , wherein each fin is made of aluminum, copper, other metal, or material other than pyrolytic graphite.
16 . The apparatus of claim 14 , wherein the pipe has a central axis, each fin has a first thermal conductivity in a radial direction perpendicular to the central axis and a second thermal conductivity in an axial direction parallel to the central axis, and the first thermal conductivity is at least 100 times the second thermal conductivity.
17 . The apparatus of claim 14 , further comprising a heat source thermally coupled to the pipe.
18 . The apparatus of claim 17 , further comprising a thermal bridge between the pipe and the heat source, the thermal bridge being any combination of one or more of a heat sink, a heat spreader, a printed circuit board, a standoff, and a rail.
19 . The apparatus of claim 17 , wherein the heat source is an electronic component capable of generating heat.
20 . The apparatus of claim 14 , further comprising a pump attached to the pipe and configured to pump fluid through the pipe.