Semiconductor device
A semiconductor substrate of a semiconductor device includes a body region of a first conductivity type, a drift region of a second conductivity type coming into contact with a lower surface of the body region, a gate electrode that is provided in a gate trench passing through the body region and extending to the drift region and faces the body region, and a gate insulator that is provided between the gate electrode and a wall surface of the gate trench. An inverted U-shaped section is formed in a lower surface of the gate insulator, and a floating region of the first conductivity type is formed in the inverted U-shaped section. The floating region protrudes under a portion that is located at a lowermost portion in the lower surface of the gate insulator.
1. A semiconductor device comprising:
a semiconductor substrate that includes: a body region of a first conductivity type formed in an upper surface of the semiconductor substrate; a drift region of a second conductivity type that is contacted with a lower surface of the body region; a gate electrode that is provided in a gate trench passing through the body region and extending to the drift region and faces the body region; a gate insulator that is provided between the gate electrode and a wall surface of the gate trench and formed with an inverted U-shaped section in a lower surface; and a floating region of the first conductivity type that is enclosed by the inverted U-shaped section and the drift region and in which a lower surface of the floating region is formed under a portion that is located at a lowermost portion in the lower surface of the gate insulator;
a first main electrode that is formed on the upper surface of the semiconductor substrate and connected to the body region; and
a second main electrode that is formed on a lower surface of the semiconductor substrate.
2. The semiconductor device according to claim 1 , wherein a width of the floating region fits within a range of a width of the gate trench in a cross section where the semiconductor substrate is cut away in a plane that is perpendicular to an upper surface of the semiconductor substrate and also orthogonal to a longitudinal direction of the gate trench.
3. The semiconductor device according to claim 2 , wherein the width of the floating region fits within the width of the inverted U-shaped section in the cross section.