Integrated circuit comprising a thermal conductivity based gas sensor
View Patent ↗An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes a relative humidity sensor on the substrate. The relative humidity sensor includes a first sensor electrode, a second sensor electrode, and a humidity sensitive layer covering the first and second electrodes. The integrated circuit further includes a thermal conductivity based gas sensor on the substrate. The thermal conductivity based gas sensor has an electrically resistive sensor element located above the humidity sensitive layer.
1. An integrated circuit comprising:
a semiconductor substrate;
a relative humidity sensor on the substrate, the relative humidity sensor comprising a first sensor electrode, a second sensor electrode, and a humidity sensitive layer covering the first and second electrodes; and
a thermal conductivity based gas sensor on the substrate, the gas sensor having an electrically resistive sensor element located above the humidity sensitive layer,
wherein the electrically resistive sensor element is located on an upper surface of the humidity sensitive layer.
2. The integrated circuit of claim 1 comprising vias passing through the humidity sensitive layer, wherein the vias contain electrically conductive material connecting to the electrically resistive sensor element of the thermal conductivity based gas sensor.
3. The integrated circuit of claim 2 , wherein the electrically conductive material in the vias partially fills and coats sidewalls of the vias.
4. The integrated circuit of claim 1 comprising a metallization stack on a major surface of the substrate and a passivation stack on the metallization stack, wherein relative humidity sensor and the thermal conductivity based gas sensor are both located above the passivation stack.
5. The integrated circuit of claim 4 comprising vias passing through the passivation stack, wherein the vias are filled with electrically conductive material connecting the metallization stack to at least one of the electrically resistive sensor element and the first and second sensor electrodes of the relative humidity sensor.
6. The integrated circuit of claim 4 comprising an opening through the humidity sensitive layer and the passivation stack for providing access to a bond pad in the metallization stack for making electrical connection to the integrated circuit.
7. The integrated circuit of claim 1 , wherein the thermal conductivity based gas sensor is located adjacent the relative humidity sensor on the substrate.
8. The integrated circuit of claim 1 , wherein the electrically resistive sensor element of the thermal conductivity based gas sensor extends in a plane parallel to a major surface of the substrate.
9. The integrated circuit of claim 1 further comprising:
a temperature sensor, and
at least one further type of sensor.
10. A Radio Frequency Identification (RFID) tag comprising the integrated circuit of claim 1 .
11. A mobile communications device comprising the integrated circuit of claim 1 .
12. A heating, ventilation and air conditioning (HVAC) system comprising one or more integrated circuits according to claim 1 .
13. A method of making an integrated circuit, the method comprising:
providing a semiconductor substrate;
forming a relative humidity sensor on the substrate by forming a first sensor electrode and a second sensor electrode, and then depositing a humidity sensitive layer to cover the first and second electrodes; and
forming a thermal conductivity based gas sensor on the substrate by forming an electrically resistive sensor element above the humidity sensitive layer of the relative humidity sensor and locating the electrically resistive sensor element on an upper surface of the humidity sensitive layer.