IP Library Granted Patent US 9,583,655
Granted Patent B2
US 9,583,655 · App. 14/048,086 · Granted Feb 28, 2017

Method of making photovoltaic device having high quantum efficiency

Inventor: Tzu-Huan Cheng (Kaohsiung, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
H01L31/0322H01L31/0323H01L31/0749H01L31/1864Y02E10/541Y02P70/521
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Quick Facts
Patent No.
US 9,583,655
App. No.
14/048,086
Granted
Feb 28, 2017
Kind
B2
Abstract

A method of fabricating a photovoltaic device includes forming an absorber layer comprising an absorber material above a substrate, forming a buffer layer over the absorber layer, forming a front transparent layer over the buffer layer, and exposing the photovoltaic device to heat or radiation at a temperature from about 80° C. to about 500° C. for a period of time, subsequent to the step of forming a buffer layer over the absorber layer.

Claims (37)

1. A method of fabricating a photovoltaic device, comprising forming an absorber layer comprising an absorber material above a substrate;

forming a buffer layer over the absorber layer;

forming a front transparent layer over the buffer layer; and

exposing the photovoltaic device to heat or radiation at a temperature from about 100° C. to about 500° C. for multiple cycles in a total period of time in the range of from about 10 minutes to about 30 minutes, subsequent to the step of forming a buffer layer over the absorber layer.

2. The method of claim 1 , further comprising:

forming a back contact layer above the substrate before the step of forming the absorber layer above the substrate.

3. The method of claim 1 , wherein

the photovoltaic device is exposed to the heat or radiation after the step of forming the front transparent layer over the buffer layer.

4. The method of claim 1 , further comprising:

forming an anti-reflection layer over the front transparent layer.

5. The method of claim 4 , wherein

the photovoltaic device is exposed to the heat or radiation after the step of forming the anti-reflection layer over the front transparent layer.

6. The method of claim 1 , wherein

the radiation is selected from the group consisting of microwave, infrared (IR) and ultraviolet (UV) light.

7. The method of claim 1 , wherein

the photovoltaic device is exposed to the heat at a temperature in the range of from 100° C. to 300° C.

8. The method of claim 1 , wherein

the photovoltaic device is exposed to microwave as the radiation at a temperature in the range of from about 200° C. to about 300° C.

9. The method of claim 1 , wherein

the photovoltaic device is exposed to infrared light as the radiation at a temperature in the range of from about 200° C. to about 400° C.

10. The method of claim 1 , wherein

the absorber material in the absorber layer is selected from the group consisting of copper indium gallium selenide (CIGS) and cadmium telluride (CdTe); and

the buffer layer comprises a buffer material selected from the group consisting of ZnS, CdS and CdSe.

11. A method of fabricating a photovoltaic device, comprising

forming a back contact layer above a substrate;

forming an absorber layer comprising an absorber material above the substrate;

forming a buffer layer over the absorber layer;

forming a front transparent layer over the buffer layer; and

exposing the photovoltaic device to heat or radiation at a temperature from about 100° C. to about 500° C. for multiple cycles in a total period of time in the range of from about 10 minutes to about 30 minutes, subsequent to the step of forming the front transparent layer over the buffer layer.

12. The method of claim 11 , further comprising:

forming an anti-reflection layer over the front transparent layer.

13. The method of claim 11 , wherein

the photovoltaic device is exposed to heat or radiation after the step of forming the anti-reflection layer over the front transparent layer.

14. The method of claim 11 , wherein

the photovoltaic device is exposed to the heat at a temperature in the range of from about 100° C. to about 300° C.

15. The method of claim 14 , wherein

the photovoltaic device is simultaneously exposed to a type of radiation in addition to the heat, the radiation being selected from the group consisting of microwave, infrared (IR) and ultraviolet (UV) light.

Assignments (2)
MERGER Recorded Jun 16, 2016
From: TSMC SOLAR LTD.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 039050/0299 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2013
From: CHENG, TZU-HUAN
To: TSMC SOLAR LTD.
Reel/Frame 031359/0850 →
Continuity (1)
Related Publication 20150096609A1 · Apr 9, 2015