Package for an implantable neural stimulation device
An implantable device, including a first electrically non-conductive substrate with a plurality of electrically conductive vias. The device also includes a flip-chip multiplexer circuit attached to the electrically non-conductive substrate using conductive bumps, the circuit being electrically connected to at a subset of the plurality of electrically conductive vias. Another a flip-chip driver circuit is attached to the flip-chip multiplexer circuit using conductive bumps while a second electrically non-conductive substrate attached to the flip-chip driver circuit using conductive bumps. Discrete passives are attached to the second electrically non-conductive substrate and a cover is bonded to the first electrically non-conductive substrate. The cover, the first electrically non-conductive substrate and the electrically conductive vias form a hermetic package.
1. An implantable device, comprising:
a first electrically non-conductive substrate;
a plurality of electrically conductive vias through the first electrically non-conductive substrate;
conductive traces deposited on the first electrically non-conductive substrate, the first electrically non-conductive substrate, electrically conductive vias and conductive traces forming a base;
a flip-chip circuit attached to the base using conductive bumps;
a stack chip circuit bonded to the flip chip circuit and wire bonded to the base;
a second electrically non-conductive substrate bonded to the stack chip circuit and wire bonded to the base;
discrete passives attached to the second electrically non-conductive substrate;
a braze stop on said first electrical nonconductive substrate and along a periphery of said electrically non-conductive substrate surrounding the plurality of electrically conductive vias and separating a braze joint from said plurality of electrically conductive vias; and
a cover bonded to the base, the cover and the base forming a hermetic package.
2. The implantable device according to claim 1 , wherein the electrically conductive vias are a metallic and ceramic paste co-fired with the first electrically non-conductive substrate to form a hermetic seal.
3. The implantable device according to claim 1 , wherein the cover is brazed to the base.
4. The implantable device according to claim 1 , wherein the conductive traces are metal traces.
5. The implantable device according to claim 4 , wherein the metal traces are chosen to withstand braze temperatures.
6. The implantable device according to claim 4 , wherein the metal traces comprise one or more of the metals titanium, tantalum, gold, palladium, platinum or layers or alloys thereof.
7. The implantable device according to claim 1 , further comprising a flexible circuit bump bonded to the vias.
8. The implantable device according to claim 1 , further comprising metal traces deposited on the first electrically non-conductive substrate and in contact with the electrically conductive vias; and a flexible circuit attached to the metal traces.
9. The implantable device according to claim 7 , wherein the flexible circuit is an electrode array suitable for stimulating tissue.
10. The implantable device according to claim 1 , further comprising a polymer underfill under the flip-chip circuit.
11. The implantable device according to claim 1 , wherein the conductive bumps contain at least one conductive polymer.
12. The implantable device according to claim 1 , wherein the conductive bumps contain at least one conductive epoxy or polyimide.
13. The implantable device according to claim 1 , wherein the conductive bumps are filled with one or more metals selected from the group comprising silver, platinum, iridium, titanium, platinum alloys, iridium alloys, or titanium alloys or mixtures thereof.
14. The implantable device according to claim 13 , wherein the metal or metal alloys are in dust, flake, or powder form.