Methods of Fabricating Thermoelectric Elements
Methods of fabricating a thermoelectric element with reduced yield loss include forming a solid body of thermoelectric material having first dimension of 150 mm or more and thickness dimension of 5 mm or less, and dicing the body into a plurality of thermoelectric legs, without cutting along the thickness dimension of the body. Further methods include providing a metal material over a surface of a thermoelectric material, and hot pressing the metal material and the thermoelectric material to form a solid body having a contact metal layer and a thermoelectric material layer.
1 . A method of fabricating a thermoelectric element, comprising:
forming a solid body comprising thermoelectric material having first dimension of 150 mm or more and a thickness dimension of 5 mm or less; and
dicing the body into a plurality of thermoelectric legs, without cutting along the thickness dimension of the body.
2 . The method of claim 1 , wherein: the solid body is formed by hot pressing particles of thermoelectric material, and wherein each leg has a length of 0.5-5 mm, a width of 0.5-5 mm, and a thickness of 0.5-5 mm.
3 . The method of claim 2 , wherein the particles are nano-sized particles.
4 . The method of claim 2 , wherein the particles are micro-sized particles.
5 . The method of claim 2 , wherein the solid body is formed by hot pressing a semiconductor thermoelectric material and a metal material to produce a solid body having at least one contact metal layer over a surface of the semiconductor thermoelectric material.
6 . The method of claim 1 , wherein yield losses from dicing due to edge loss and kerf loss is less than approximately 1%.
7 . A solid body comprising thermoelectric material having a first dimension of 150 mm or more and a thickness dimension of 5 mm or less, wherein the solid body is formed by hot pressing particles of thermoelectric material.
8 . The solid body of claim 7 , wherein the particles are nano-sized particles.
9 . The solid body of claim 7 , wherein the particles are micro-sized particles.
10 . The solid body of claim 7 , further comprising at least one contact metal layer over a surface of the thermoelectric material.
11 . The solid body of claim 10 , wherein the contact metal layer is formed by hot pressing a metal material over a surface of the thermoelectric material.
12 . The solid body of claim 11 , further comprising an interlayer which comprises the metal material and at least one constituent of the thermoelectric material between the contact metal layer and the thermoelectric material layer.
13 . The solid body of claim 12 , wherein a thickness of the thermoelectric material layer is 0.5 to 5 mm, a thickness of the contact metal layers is 0.05 to 1 mm, and a thickness of the interlayer is 1 to 100 μm.
14 . The solid body of claim 12 , further comprising first and second contact metal layers and first and second interlayers between the respective first and second contact metal layers and the thermoelectric material.
15 . The solid body of claim 7 , wherein the thermoelectric material comprises a bismuth telluride based thermoelectric material.
16 . The solid body of claim 7 , wherein the thermoelectric material comprises a half-Heusler thermoelectric material.
17 . The solid body of claim 7 , wherein the hot pressing particles of thermoelectric material comprises simultaneously applying a pressure of 20-200 MPa at a temperature of 200-1500° C. for a period of between 30 seconds and 2 hours.
18 . A method of fabricating a thermoelectric element, comprising:
providing a metal material over a surface of a thermoelectric material; and
hot pressing the metal material and the thermoelectric material to form a solid body having a contact metal layer and a thermoelectric material layer.
19 . The method of claim 18 , further comprising forming an interlayer which comprises the metal material and at least one constituent of the thermoelectric material between the contact metal layer and the thermoelectric material layer during the step of hot pressing.
20 . The method of claim 19 , wherein a thickness of the thermoelectric material layer is 0.5 to 5 mm, a thickness of the contact metal layers is 0.05 to 1 mm, and a thickness of the interlayer is 1 to 100 μm.