High dielectric compositions for particle formation and methods of forming particles using same

1. A system for particle formation, comprising:

a) a high dielectric composition comprising

a high dielectric solvent having a dielectric constant of at least 15;

a high dielectric polymer dissolved into the high dielectric solvent, the polymer having a dielectric constant of at least 5; and

a high dielectric additive dispersed within the composition, the additive having a dielectric constant of at least 100;

wherein the polymer concentration is between about 10 wt % and 25 wt % of the composition; and

b) a particle formation apparatus for forming particles using the high dielectric composition.

2. The system of claim 1 wherein the high dielectric polymer has a dielectric constant greater than 8.

3. The system of claim 1 wherein the high dielectric polymer has a dielectric constant between 10 and 12.

4. The system of claim 1 wherein the high dielectric solvent has a dielectric constant of at least 40.

5. The system of claim 1 wherein the high dielectric additive has a dielectric constant of at least 50.

6. The system of claim 1 wherein the high dielectric additive has a dielectric constant of at least 1000.

7. The system of claim 1 wherein the solvent includes dimethyl sulfoxide (DMSO).

8. The system of claim 1 wherein the solvent includes acetone.

9. The system of claim 1 wherein the solvent includes methyl-ethyl-ketone (MEK).

10. The system of claim 1 wherein the high dielectric additive includes at least one of:

a) polyglycol;

b) glycol;

c) mannitol;

d) ionic liquid;

e) polyglycerol;

f) glycerol;

g) titanium dioxide;

h) barium titanate;

i) calcium copper titanate (CCTO)

j) lanthanum strontium nickelate nanopowder;

k) samarium oxides;

l) samarium titanates;

m) lanthanum oxides;

n) lanthanum titanates;

o) strontium oxide;

p) strontium titanates;

q) nanopowders of metal, bi-metal, and multi-metal oxides or titanates;

r) metals;

s) surface functionalized nanoparticles;

t) metal nanoparticles with an organic coating;

u) iron carbonyl;

v) conjugated polymers;

w) liquid crystals; and

x) nano-particles of metals including one or more of nickel, silver, aluminum, gold, transition metals including manganese, cobalt, and alloys including stainless steel.

11. The system of claim 1 wherein the high dielectric additive is dispersed within the composition using a dispersing agent.

12. The system of claim 1 wherein the solvent includes at least one of:

a) acetone;

b) acetonitrile;

c) acetophenone;

d) acetyl chloride;

e) acrylonitrile;

f) gamma-butyrolectone;

g) cyclohexanone;

h) N,N-dimethylacetamide;

i) N,N-dimethylformamide;

j) dimethylsulfoxide;

k) 1,4-dioxane;

l) ethylene glycol;

m) ethyl formate;

n) formamide;

o) formic acid;

p) methanol;

q) methyl ethyl ketone;

r) N-methyl-2-pyrrolidone;

s) nitromethane;

t) 2-nitropropane;

u) propylene-1,2-carbonate;

v) tetrahydrofuran;

w) tetramethylurea;

x) triethyl phosphate; and

y) trimethyl phosphate.

13. The system of claim 1 , wherein the polymer includes at least one of:

a) PVDF;

b) PVDF co- and ter-polymers;

c) polyurethane;

d) phenolic;

e) PVF film;

f) vinylidene fluoride-trifluoroethylene copolymer; and

g) polycaprolactone.

14. A system for particle formation, comprising:

a) a high dielectric composition comprising

a high dielectric solvent; and

a high dielectric polymer dissolved into the high dielectric solvent; and

a high dielectric additive dispersed within the composition; and

b) a particle formation apparatus for forming particles using the high dielectric composition;

wherein the polymer includes at least one of: PVDF, PVDF co- and ter-polymers, polyurethane, phenolic, PVF film, vinylidene fluoride-trifluoroethylene copolymer, and polycaprolactone; and

wherein the polymer concentration is between about 10 wt % and 25 wt %.

15. The system of claim 14 wherein the high dielectric polymer has a dielectric constant of at least 5.

16. The system of claim 14 wherein the high dielectric polymer has a dielectric constant greater than 8.

17. The system of claim 14 wherein the high dielectric polymer has a dielectric constant between 10 and 12.

18. The system of claim 14 wherein the high dielectric solvent has a dielectric constant of at least 15.

19. The system of claim 14 wherein the high dielectric solvent has a dielectric constant of approximately 40.

20. The system of claim 14 wherein the high dielectric additive has a dielectric constant of at least 50.

21. The system of claim 14 wherein the high dielectric additive has a dielectric constant of at least 100.

22. The system of claim 14 wherein the high dielectric additive has a dielectric constant of at least 1000.

23. The system of claim 14 wherein the solvent includes dimethyl sulfoxide (DMSO).

24. The system of claim 14 wherein the solvent includes acetone.

25. The system of claim 14 wherein the solvent includes methyl-ethyl-ketone (MEK).

26. The system of claim 14 wherein the high dielectric additive includes at least one of:

a) polyglycol;

b) glycol;

c) mannitol;

d) ionic liquid;

e) polyglycerol;

f) glycerol;

g) titanium dioxide;

h) barium titanate;

i) calcium copper titanate (CCTO);

j) lanthanum strontium nickelate nanopowder;

k) samarium oxides;

l) samarium titanates;

m) lanthanum oxides;

n) lanthanum titanates;

o) strontium oxide;

p) strontium titanates;

q) nanopowders of metal, bi-metal, and multi-metal oxides or titanates;

r) metals;

s) surface functionalized nanoparticles;

t) metal nanoparticles with an organic coating;

u) iron carbonyl;

v) conjugated polymers;

w) liquid crystals; and

x) nano-particles of metals including one or more of nickel, silver, aluminum, gold, transition metals including manganese, cobalt, and alloys including stainless steel.

27. The system of claim 14 wherein the high dielectric additive is dispersed within the composition using a dispersing agent.

28. The system of claim 14 wherein the solvent includes at least one of:

a) acetone;

b) acetonitrile;

c) acetophenone;

d) acetyl chloride;

e) acrylonitrile;

f) gamma-butyrolectone;

g) cyclohexanone;

h) N,N-dimethylacetamide;

i) N,N-dimethylformamide;

j) dimethylsulfoxide;

k) 1,4-dioxane;

l) ethylene glycol;

m) ethyl formate;

n) formamide;

o) formic acid;

p) methanol;

q) methyl ethyl ketone;

r) N-methyl-2-pyrrolidone;

s) nitromethane;

t) 2-nitropropane;

u) propylene-1,2-carbonate;

v) tetrahydrofuran;

w) tetramethylurea;

x) triethyl phosphate; and

y) trimethyl phosphate.

29. The system of claim 14 , wherein the apparatus comprises a reservoir storing the high dielectric composition.

30. The system of claim 14 , wherein the apparatus is in communication with a reservoir storing the high dielectric composition.