Nitride light-emitting diode element and method of manufacturing same
View Patent ↗A nitride LED having improved light extraction efficiency and/or axial luminous intensity is provided. The nitride LED contains a nitride semiconductor substrate having, on a front face thereof, a light-emitting structure made of a nitride semiconductor, wherein a roughened region is provided on a back face of the substrate, the roughened region has a plurality of protrusions, each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane, the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and light generated in the light-emitting structure is output to the exterior through the roughened region.
1. A method of manufacturing a nitride LED, comprising a first step of providing a roughened region on a back face of a nitride semiconductor substrate having, on a front face thereof, a light-emitting structure made of a nitride semiconductor,
wherein the roughened region has a plurality of protrusions,
each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane,
the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and
in the first step, the roughened region is formed by dry etching treatment of the substrate.
2. A method of manufacturing a nitride LED, comprising:
a first step of preparing a nitride semiconductor stack which comprises a nitride semiconductor substrate and a light-emitting portion formed of a nitride semiconductor having a multilayer film structure stacked on the substrate; and
a second step of providing a roughened region on a substrate side face of the stack,
wherein the roughened region has a plurality of protrusions,
each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane,
the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and
in the second step, the roughened region is formed by dry etching treatment of the nitride semiconductor stack.
3. A method of manufacturing a nitride LED, comprising:
a first step of preparing a multilayer structure in which a plurality of nitride semiconductor layers including an n-type nitride semiconductor layer, an active layer and a p-type nitride semiconductor layer are stacked on one face of a first nitride semiconductor layer; and
a second step of providing a roughened region on another face of the first nitride semiconductor layer,
wherein the roughened region has a plurality of protrusions,
each of the plurality of protrusions has a top point or top plane and has a horizontal cross-section which is circular, except in areas where the protrusion is tangent to other neighboring protrusions, and which has a surface area that decreases on approaching the top point or top plane,
the plurality of protrusions are arranged such that any one protrusion is in contact with six other protrusions, and
in the second step, the roughened region is formed by dry etching treatment of the first nitride semiconductor layer.
4. The manufacturing method according to claim 1 , wherein each of the plurality of protrusions has a peripheral shape which, in a top view of the roughened region, is a hexagon.
5. The manufacturing method according to claim 4 , wherein each of the plurality of protrusions has a peripheral shape which, in a top view of the roughened region, is a regular hexagon.
6. The manufacturing method according to claim 1 , wherein each of the plurality of protrusions is located at a lattice position of a triangular lattice, and each of the plurality of protrusions has a height which is from 0.4 to 1.5 times the pitch of the triangular lattice.
7. The manufacturing method according to claim 1 , wherein each of the plurality of protrusions has a height of from 1 to 8 μm.