Patterned fine particle film structures
View Patent ↗A patterned fine particle film structure includes a fine particle layer including fine particles arranged and bound to a surface of a substrate coated with a patterned film including a first film compound having a first functional group. The fine particles are coated with films including a first coupling agent having a first coupling reactive group that undergoes a coupling reaction with the first functional group to form a bond. The fine particle layer is bound by a bond formed through a coupling reaction. In an embodiment, fine particles coated with films of a film compound that reacts with the first coupling reactive group and the fine particles are alternately bound to the substrate.
1. A method of forming a film structure, the method comprising:
linking a first linker to a substrate such that the first linker extends a first reactant product away from the substrate;
linking a second linker to a particle such that the second linker extends a second reactant product away from the particle; and
coupling the first reactant product of the first linker to the second reactant product of the second linker with a coupling agent so as to link the particle to the substrate, wherein the coupling agent reacts with the first linker and second linker, wherein the coupling agent comprises an imidazole, a compound including two or more epoxy groups, a compound including two or more isocyanate groups, an acid anhydride, dicyandiamide, or a phenol derivative.
2. The method of claim 1 , wherein:
linking the first linker to the substrate comprises linking the first linker to the substrate through one or more first active hydrogen groups of the substrate; and
linking the second linker to the particle comprises linking the second linker to the particle through one or more second active hydrogen groups of the particle.
3. The method of claim 1 , wherein the coupling agent comprises an imidazole having both an amine and an imine, wherein coupling the first reactant product of the first linker to the second reactant product of the second linker comprises:
reacting an epoxide of the first linker with an amine or imine of the imidazole coupling agent; and
reacting an epoxide of the second linker with an amine or imine of the imidazole coupling agent.
4. The method of claim 1 , wherein the coupling agent comprises a compound including two or more epoxy groups, or a compound including two or more isocyanate groups, wherein coupling the first reactant product of the first linker to the second reactant product of the second linker comprises:
reacting an amine or imine of the first linker with an epoxy or isocyanate of the coupling agent; and
reacting an amine or imine of the second linker with an epoxy or isocyanate of the coupling agent.
5. The method of claim 1 , further comprising:
forming a film on the substrate with a plurality of the first linkers; and
forming a second film on the particle with a plurality of the second linkers.
6. The method of claim 1 :
wherein the substrate includes one or more first active hydrogen groups;
wherein linking the first linker to the substrate comprises linking a first plurality of alkoxysilane linkers to the substrate through the one or more first active hydrogen groups, the first plurality of alkoxysilane linkers each having a first epoxide, a first amine or a first imine group;
further comprising removing a portion of the first plurality of alkoxysilane linkers to form a pattern on the substrate;
wherein the particle includes a plurality of particles, each having one or more second active hydrogen groups;
wherein linking a second linker to a particle comprises linking a second plurality of alkoxysilane linkers to the plurality of particles through the second active hydrogen groups, the second plurality of alkoxysilane linkers each having a second epoxide, a second amine or a second imine group; and
wherein coupling the first reactant product of the first linker to the second reactant product of the second linker comprises coupling the first epoxide, the first amine or the first imine group of the first plurality of alkoxysilane linkers to the second epoxide, second amine or second imine group of the second plurality of alkoxysilane linkers with the coupling agent so as to form a first layer of particles having the pattern.
7. The method of claim 6 , further comprising forming a second layer of a second plurality of particles on the first layer of particles.
8. The method of claim 6 , wherein the pattern is formed using a patterning treatment in which the first plurality of alkoxysilane linkers are subjected to light irradiation through a mask covering a pattern region.
9. A method of forming a film structure, the method comprising:
providing a substrate having one or more first active hydrogen groups;
linking a first plurality of alkoxysilane linkers to the substrate through the first active hydrogen groups, the first plurality of alkoxysilane linkers having a first epoxide, a first amine or a first imine group;
selectively removing a portion of the first plurality of alkoxysilane linkers to form a pattern on the substrate;
providing a plurality of fine particles having one or more second active hydrogen groups;
linking a second plurality of alkoxysilane linkers to the fine particles through the second active hydrogen groups, the second plurality of alkoxysilane linkers having a second epoxide, a second amine or a second imine group; and
reacting:
a coupling agent with the first epoxide, first amine or first imine group of the first plurality of alkoxysilane linkers and then reacting the coupling agent with the second epoxide, second amine or second imine group of the second plurality of alkoxysilane linkers; or
a coupling agent with the second epoxide, second amine or second imine group of the second plurality of alkoxysilane linkers and then reacting the coupling agent with the first epoxide, first amine or first imine group of the first plurality of alkoxysilane linkers;
wherein the coupling agent comprises an imidazole, a compound including two or more epoxy groups, a compound including two or more isocyanate groups, an acid anhydride, dicyandiamide, or a phenol derivative, so as to link the particle to the substrate, wherein the coupling agent reacts with the first linker and second linker.
10. The method of claim 1 , wherein the first linker comprises an alkoxysilane compound including an alkoxysilyl group at an end for linking the first linker to the substrate, the first linker further comprising an epoxide group at another end for linking to the second linker.
11. The method of claim 10 , wherein the epoxide group of the first linker is selected from the group consisting of a glycidyl group, a 3,4-epoxycyclohexyl group, and combinations thereof.
12. A method of forming a film structure, the method comprising:
providing a functionalized substrate comprising a plurality of first alkoxysilane linkers comprising first epoxide groups, first amine or first imine groups linked to the substrate;
selectively removing a portion of the alkoxysilane linkers to form a pattern on the substrate;
providing a plurality of functionalized fine particles comprising a plurality of second alkoxysilane linkers comprising second epoxide groups, second amine or second imine groups; and
reacting:
a coupling agent with the first epoxide, first amine or first imine group of the first plurality of alkoxysilane linkers and then reacting the coupling agent with the second epoxide, second amine or second imine group of the second plurality of alkoxysilane linkers; or
a coupling agent with the second epoxide, second amine or second imine group of the second plurality of alkoxysilane linkers and then reacting the coupling agent with the first epoxide, first amine or first imine group of the first plurality of alkoxysilane linkers;
wherein the coupling agent comprises an imidazole, a compound including two or more epoxy groups, or a compound including two or more isocyanate groups.
13. The method of claim 12 , wherein providing the functionalized substrate comprises applying a reaction solution to a surface of the substrate, the reaction solution comprising:
an alkoxysilane compound having an alkoxysilyl group and a functional group selected from the group consisting of an epoxy group, an amine group, an imine group, and combinations thereof;
a condensation catalyst for promoting a condensation reaction between alkoxysilyl groups and hydroxyl groups on the surface of the substrate; and
an organic solvent.
14. The method of claim 13 , wherein the condensation catalyst comprises a metal salt.
15. The method of claim 14 , wherein the metal salt is selected from the group consisting of metal carboxylate salts, metal carboxylate ester salts, metal carboxylate salt polymers, metal carboxylate salt chelates, and combinations thereof.
16. The method of claim 14 , wherein the metal salt is selected from the group consisting of titanate esters, titanate ester chelates, and combinations thereof.
17. The method of claim 14 , wherein the condensation catalyst further comprises a cocatalyst selected from the group consisting of ketamine compounds, organic acids, aldimine compounds, enamine compounds, oxazolidine compounds, aminoalkylalkoxysilane compounds, and combinations thereof.
18. The method of claim 12 , wherein the fine particles have a size from about 10 nm to about 0.1 mm.
19. The method of claim 12 , wherein the coupling agent comprises an imidazole.
20. The method of claim 12 , further comprising removing any fine particles not bound to the substrate.
21. The method of claim 1 , wherein the coupling agent comprises a compound having two or more isocyanate groups.
22. The method of claim 1 , wherein the coupling agent comprises a compound having two or more epoxy groups.