Resistive heating device for fabrication of nanostructures
View Patent ↗Apparatuses and techniques relating to a resistive heating device are provided.
1. A heating device, comprising:
a nanostructure including:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure.
2. The heating device of claim 1 , further comprising:
an insulating layer disposed on the substrate so as to cover at least a portion of a surface of the at least one electrically-conductive elongated structure.
3. The heating device of claim 1 , wherein the remaining portions of the at least one electrically-conductive elongated structure comprise carbon nano-tube (CNT), graphene, or combinations thereof.
4. The heating device of claim 1 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises metal carbide.
5. The heating device of claim 1 , wherein the at least one heat-conductive column comprises a material selected from the group consisting of alumina, other metal oxides, metal carbides, and combinations thereof.
6. The heating device of claim 1 , wherein the substrate comprises at least one elastomeric material.
7. The heating device of claim 1 , wherein the at least one heat-conductive column extends longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.
8. The heating device of claim 1 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises a metal carbide selected from the group consisting of titanium carbide, molybdenum carbide, and combinations thereof.
9. The heating device of claim 1 , wherein the heating device is configured as a generally cylindrical heat roller that includes the at least one heat-conductive column formed on lateral outer circumference portions of the generally cylindrical heating device.
10. The heating device of claim 1 , wherein the at least one heat-conductive column extends generally perpendicular relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is formed.
11. The heating device of claim 1 , wherein the at least one resistive portion in the at least one electrically-conductive elongated structure has a transverse cross-sectional shape and size that is substantially identical to that of the at least one electrically-conductive elongated structure in which it is formed, the at least one resistive portion being entirely contained within outer dimensions of the at least one electrically-conductive elongated structure extending on either side thereof.
12. The heating device of claim 1 , wherein the at least one heat-conductive column is formed of a material having a higher thermal conductivity and a lower electrical conductivity than that of the resistive portion on which it is formed.
13. The heating device of claim 1 , wherein the at least one resistive portion has a side-length measuring from about 50 nm to about 500 nm.
14. The heating device of claim 1 , wherein the at least one heat-conductive column has a width measuring from about 50 nm to about 500 nm.
15. A nanostructure heating device, comprising:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure, the at least one heat-conductive column extending longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.
16. The device of claim 15 , wherein the at least one resistive portion is disposed in the at least one electrically-conductive elongated structure.
17. The device of claim 15 , wherein the resistive portion of the at least one electrically-conductive elongated structure comprises a metal carbide.
18. The device of claim 15 , wherein the substrate comprises at least one elastomeric material.
19. The device of claim 15 , wherein the at least one heat-conductive column comprises a material selected from the group consisting of alumina, other metal oxides, metal carbides, and combinations thereof.
20. A nanostructure heating device, comprising:
a substrate;
at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion disposed therein, the at least one resistive portion comprising a metal carbide and having a conductivity lower than that of remaining portions of the at least one electrically-conductive elongated structure, the remaining portions of the at least one electrically-conductive elongated structure comprising carbon nano-tube (CNT), graphene, or combinations thereof; and
at least one heat-conductive column directly disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure, the at least one heat-conductive column extending longitudinally non-parallel relative to the at least one electrically-conductive elongated structure on which the at least one heat-conductive column is disposed.
21. The heating device of claim 1 , wherein the at least one resistive portion is located between the substrate and the at least one heat-conductive column.
22. The heating device of claim 1 , wherein each at least one elongated structure is configured to be controlled independently.