Granted Patent B2

US 9,257,946 · App. 14/054,681 · Granted Feb 9, 2016

Abstract

Claims (10)

1. A radio frequency (RF) amplifier circuit comprising:

a packaged amplifier circuit having a transistor connected to an output of the packaged amplifier circuit, the packaged amplifier circuit further comprising, between the transistor and the output:

a low-pass RF matching network comprising an un-shunted RF matching capacitance connected to ground; and

a baseband decoupling network connected in parallel with the low-pass RF matching network, the baseband decoupling network comprising a series arrangement comprising a decoupling capacitor and an inductance connected in series between a drain of the transistor and ground, wherein the baseband decoupling network is provided inside the package and the output of the packaged amplifier circuit is configured to be connected to a low pass matching network via an inductive connection.

2. The RF amplifier circuit of claim 1 , wherein the inductance comprises a pair of inductors connected in series.

3. The RF amplifier circuit of claim 1 , wherein the inductive connection comprises at least one wire bond.

4. The RF amplifier circuit of claim 1 , wherein the RF matching capacitance is connected to a low pass matching network via an inductive connection.

5. The RF amplifier circuit of claim 4 , wherein the inductive connection comprises at least one wire bond.

6. An integrated circuit comprising the RF amplifier circuit according to claim 1 .

7. A mobile base station comprising the RF amplifier circuit according to claim 1 .

Assignments (13)