Cleaning composition and cleaning method using the same
View Patent ↗A cleaning composition is provided. The cleaning composition includes at least one polyamino-polycarboxylic acid or at least one salt thereof, at least one solvent, at least one substituted or non-substituted phenethylamine and water. The solvent is selected from a group consisting of glycols.
1. A cleaning composition, the cleaning composition comprising:
at least one polyamino-polycarboxylic acid or at least one salt thereof;
at least one solvent, wherein the solvent is selected from a group consisting of glycols; and
at least one substituted or unsubstituted phenethylamine; and
water.
2. The cleaning composition as claimed in claim 1 , wherein the polyamino-polycarboxylic acid is a triamine pentaacetic acid.
3. The cleaning composition as claimed in claim 2 , wherein the triamine pentaacetic acid is selected from a group consisting of ethylene triamine pentaacetic acid, diethylene triamine pentaacetic acid and triethylene triamine pentaacetic acid.
4. The cleaning composition as claimed in claim 1 , wherein the salt of the polyamino-polycarboxylic acid is selected from a group consisting of alkali metal salts, alkaline earth metal salts and ammonium salts.
5. The cleaning composition as claimed in claim 1 , wherein a content of the polyamino-polycarboxylic acid or the salt thereof is 0.001 wt % to 10 wt %, relative to a total weight of the cleaning composition.
6. The cleaning composition as claimed in claim 1 , wherein the solvent is selected from a group consisting of 2-methoxyethanol, 2-ethoxyethanol, 2-propoxyethanol, 2-isopropoxyethanol, 2-butoxyethanol, 2-phenoxyethanol, 2-(2-methoxyethoxyl)ethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, 2-isobutoxyethanol, 1,2-propylene glycol, 1,3-propylene glycol, diethylene glycol, triethylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 2,3-dimethyl-2,3-butanediol and derivatives thereof.
7. The cleaning composition as claimed in claim 1 , wherein a content of the solvent is 0.001 wt % to 10 wt %, relative to a total weight of the cleaning composition.
8. The cleaning composition as claimed in claim 1 , wherein the substituted or unsubstituted phenethylamine includes a compound represented by Formula (1):
wherein R 2 , R 3 , R 4 , R 5 , R α , R β and R N are each independently hydrogen, a hydroxyl group, an alkyl group or a hydroxyalkyl group.
9. The cleaning composition as claimed in claim 1 , wherein a content of the substituted or unsubstituted phenethylamine is 0.001 wt % to 10 wt %, relative to a total weight of the cleaning composition.
10. The cleaning composition as claimed in claim 1 , wherein a content of the water is 70 wt % to 99.997 wt %, relative to a total weight of the cleaning composition.
11. The cleaning composition as claimed in claim 1 , wherein a pH value of the cleaning composition is 8˜12.
12. A cleaning method, comprising:
using the cleaning composition of claim 1 to clean a wafer.
13. The method as claimed in claim 12 , further comprises cleaning the wafer after performing chemical mechanical polishing to the wafer.