IP Library Granted Patent US 9,052,099
Granted Patent B2
US 9,052,099 · App. 14/055,460 · Granted Jun 9, 2015

LED lamp

Inventors: Yusaku Kawabata (Kyoto, JP); Hiroshi Fukumoto (Kyoto, JP); Takao Iemoto (Kyoto, JP); Toshio Watanabe (Kyoto, JP); Hideharu Osawa (Kyoto, JP); Hiroyuki Fukui (Kyoto, JP); Hirotaka Shimizu (Kyoto, JP)
Assignee: ROHM CO., LTD.
F21V21/005G02B6/0003F21K9/00F21K9/17F21K9/52F21Y2101/02F21Y2103/003F21V29/004F21V23/026F21V29/70F21V29/75F21V29/763F21V29/767F21V29/83
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Quick Facts
Patent No.
US 9,052,099
App. No.
14/055,460
Granted
Jun 9, 2015
Kind
B2
Abstract

An LED lamp A 1 includes a plurality of LED modules 1 and a substrate 2 on which the LED modules 1 are mounted in a row. A light guide 3 covering the LED modules 1 is provided on the substrate 2 . The light guide 3 is held in close contact with each of the LED modules. With this arrangement, a proper amount of light is obtained with the use of a smaller number of LED modules 1 or with less power consumption.

Claims (19)

1. An LED lamp comprising:

a plurality of LED light sources;

a substrate on which the LED light sources are mounted in a row, the substrate including first and second ends spaced from each other in a longitudinal direction of the substrate;

a light guide provided on the substrate for covering the LED light sources;

a light-transmitting cover that covers an entirety of an outer surface of the light guide; and

bases attached to the first and second ends of the substrate, respectively;

wherein the light guide covers each of the LED light sources,

wherein the light guide is semicircular in cross section, and

wherein each of the bases includes a pair of terminals each configured to be fitted into an inlet port of a fluorescent lighting fixture.

2. The LED lamp according to claim 1 , further comprising a plurality of heat dissipation members attached to a surface of the substrate that is opposite to a mount surface on which the LED light sources are mounted, wherein the plurality of heat dissipation members are spaced apart from each other in a width direction of the substrate.

3. The LED lamp according to claim 2 , wherein some of the plurality of heat dissipation members are smaller in length than the rest of the plurality of heat dissipation members.

4. The LED lamp according to claim 3 , wherein the plurality of heat dissipation members are greater in length with nearness to a center of the substrate in the width direction.

5. The LED lamp according to claim 1 , wherein the light guide contains a fluorescent material that emits light of a wavelength different from a wavelength of light from the LED light sources when excited by the light from the LED light sources.

6. The LED lamp according to claim 1 , wherein the LED light source comprises an LED module, the LED module including an LED bare chip and a resin package sealing the LED bare chip.

7. The LED lamp according to claim 2 , wherein the LED light source comprises an LED bare chip mounted on the substrate.

8. The LED lamp according to claim 1 , wherein the plurality of LED light sources comprise a plurality of first series connection portions connected in parallel with each other, and each of the first series connection portions includes a predetermined number of LED modules connected in series.

9. The LED lamp according to claim 8 , wherein the plurality of LED light sources comprise a second series connection portion connected in parallel with each of the first series connection portions, the second series connection portion includes a plurality of LED modules connected in series, and the LED modules of the second series connection portion are greater in number than the LED modules of each of the first series connection portions.

10. The LED lamp according to claim 9 , wherein each of the LED modules of each of the first series connection portions is greater in brightness than each of the LED modules of the second series connection portion.

11. The LED lamp according to claim 8 , further comprising 4 diodes connected to each of the first series connection portions, wherein the 4 diodes are configured to provide a bridge rectifier circuit.

Priority Claims (8)
JP 2008-295112 · Nov 19, 2008 · national
JP 2008-295113 · Nov 19, 2008 · national
JP 2008-295114 · Nov 19, 2008 · national
JP 2008-299254 · Nov 25, 2008 · national
JP 2008-299255 · Nov 25, 2008 · national
JP 2008-306194 · Dec 1, 2008 · national
JP 2008-306196 · Dec 1, 2008 · national
JP 2008-318079 · Dec 15, 2008 · national
Continuity (2)
Continuation 13129746
Related Publication 20140043801A1 · Feb 13, 2014