IP Library Granted Patent US 9,390,737
Granted Patent B1
US 9,390,737 · App. 14/055,851 · Granted Jul 12, 2016

Method of manufacturing a magnetic recording head slider comprising bond pad having a probe contact area and a solder contact area

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Quick Facts
Patent No.
US 9,390,737
App. No.
14/055,851
Granted
Jul 12, 2016
Kind
B1
Abstract

A method for manufacturing a magnetic recording head slider is disclosed. A plurality of bond pads are formed in a linear arrangement adjacent one another on a trailing edge of a slider body. Each of the plurality of bond pads comprises a probe contact area and a soldering contact area with each area being laterally bounded in a width dimension, along the trailing edge, by respective edges of the pads wherein a width of the probe contact area is greater than a width of the soldering contact area of each respective pad whereby the probe contact area is larger than the soldering contact area.

Claims (5)

1. A method for manufacturing a magnetic recording head slider, comprising:

providing a slider body; and

forming a plurality of bond pads in a linear arrangement adjacent one another on a trailing edge of the slider body,

wherein each of the plurality of bond pads comprises a probe contact area and a soldering contact area with each area being laterally bounded in a width dimension, along the trailing edge, by respective edges of the pads wherein a width of the probe contact area is greater than a width of the soldering contact area of each respective pad whereby the probe contact area is larger than the soldering contact area.

2. The method according to claim 1 , wherein the plurality of bond pads are formed at a constant pitch along the trailing edge of the slider body, and wherein spacing between adjacent soldering contact areas is greater than spacing between adjacent probe contact areas.

Assignments (9)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038710 FRAME 0845 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL (FREMONT), LLC; WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058965/0445 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2019
From: WESTERN DIGITAL (FREMONT), LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 050450/0582 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 045501/0158 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0755 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0675 →
SECURITY AGREEMENT Recorded May 16, 2016
From: WESTERN DIGITAL (FREMONT), LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038710/0845 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2013
From: PUTTICHAEM, WACHIRA; TOKAEW, ADISAK; PAN, TZONG-SHII
To: WESTERN DIGITAL (FREMONT), LLC
Reel/Frame 031428/0006 →