MODULE FOR CONTAINING AN EARPIECE FOR AN AUDIO DEVICE

1 . A method of manufacturing an earpiece module for an audio device, the method comprising:

providing a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate at least a portion of the earpiece;

providing at least one electrical contact within the cavity on one of the first portion and second portion, positioned to engage a protruding electrical contact of the earpiece positioned within the cavity;

providing an earpiece within the cavity, the earpiece having a protruding electrical contact; and

engaging the protruding electrical contact of the earpiece and the electrical contact provided within the cavity on one of the first portion and second portion.

2 . The method of claim 1 , wherein the first portion and the second portion are opposably engageable, the method further comprising engaging the first portion and the second portion.

3 . The method of claim 2 , wherein the first portion and the second portion comprise a plastic material capable of being melted and re-solidifying, and wherein the step of engaging the first portion and the second portion comprises:

melting at least a portion of the first portion and the second portion;

engaging the melted portions of the first portion and the second portion;

and allowing the material to re-solidify.

4 . The method of claim 2 , wherein the first portion further comprises at least one plastic heat stake and the second portion comprises at least one plastic aperture sized to receive the at least one heat stake, and wherein the step of engaging the first portion and the second portion comprises:

inserting the at least one heat stake into the at least one aperture;

melting at least a portion of the plastic material of the heat stake and aperture; and

allowing the melted material to re-solidify.

5 . The method of claim 1 , wherein one of the first portion and the second portion further comprises at least one mounting apparatus for mounting the module within an audio device, the method further comprising mounting the module within an audio device using the mounting apparatus.

6 . An audio device comprising:

a housing;

an audio signal processing apparatus, mounted within the housing;

a module for containing an earpiece, the module mounted within the housing, the module comprising a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate the earpiece, the module further comprising at least one electrical contact within the cavity on one of the first portion and second portion; and

an earpiece, the earpiece provided in the cavity, the earpiece having at least one protruding electrical contact that engages the at least one electrical contact within the cavity, the earpiece being in electrical communication with the processing apparatus to receive an audio signal from the processing apparatus.

7 . The audio device of claim 6 , wherein the protruding electrical contact exerts a spring force that is borne by the module and is contained within the cavity.

8 . The audio device of claim 6 , wherein the first portion and the second portion of the module are opposably engageable.

9 . The audio device of claim 6 , wherein the first portion and the second portion of the module comprise a plastic material capable of being melted and re-solidifying to coupled the first and second portions together.

10 . The audio device of claim 6 , further comprising at least one other electrical contact outside the cavity and a circuit establishing an electrical connection between the at least one electrical contact within the cavity and the at least one other electrical contact outside the cavity, wherein the processing apparatus is in electrical communication with the earpiece via the at least one electrical contact outside the cavity and the circuit.

11 . The audio device of claim 10 , wherein the circuit comprises a flexible printed circuit board.

12 . The audio device of claim 6 , wherein the module further comprises at least one aperture sized to receive a mounting screw, the housing further comprises a threaded socket for receiving the mounting screw and the mounting screw is received by both the aperture and the threaded socket.

13 . The audio device of claim 6 , wherein the module further comprises at least one heat stake, the housing further comprises at least one socket for receiving the heat stake and the socket receives and is bonded to the heat stake.

14 . The audio device of claim 6 , wherein the module further comprises at least one socket for receiving a heat stake, the housing further comprises at least one heat stake and the socket receives and is bonded to the heat stake.

15 . The audio device of claim 6 , further comprising an audio aperture formed in one of the first portion and the second portion of the module for facilitating transmission of sound from the earpiece to exterior of the cavity.

16 . The audio device of claim 15 , further comprising a mesh extending over the audio aperture.

17 . The audio device of claim 6 , further comprising a GPS antenna mounted to one of the first portion and the second portion of the module.

18 . The audio device of claim 6 , further comprising an indicator light guide mounted to one of the first portion and the second portion of the module.