Diode and heat spreader for solar module
View Patent ↗Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet.
1. A solar system, comprising:
a plurality of solar cells;
a backsheet covering the plurality of solar cells;
a plurality of electrical components coupled to the plurality of solar cells, each electrical component disposed under the backsheet, and for each electrical component:
a respective pair of ribbon interconnects, each ribbon interconnect coupled to the electrical component and completely covered by the backsheet; and
a respective heat spreader mounted directly above the electrical component;
an encapsulant, wherein the electrical components, the ribbon interconnects, and the heat spreaders are at least partially embedded in the encapsulant; and
a substrate below the encapsulant and the plurality of electrical components,
wherein a first portion of the encapsulant is disposed between the backsheet and the heat spreader,
wherein a second portion of the encapsulant is disposed between the backsheet and respective first sides of the ribbon interconnects,
wherein a third portion of the encapsulant is disposed between respective second sides of the ribbon interconnects and the substrate, and
wherein a fourth portion of the encapsulant is disposed between the plurality of electrical components and the substrate.
2. The solar system of claim 1 , wherein each ribbon interconnect of the respective pair of ribbon interconnects is above the electrical component, and the electrical component is completely covered by the backsheet.
3. The solar system of claim 2 , wherein the electrical component is attached directly to each ribbon interconnect of the respective pair of ribbon interconnects.
4. The solar system of claim 1 , wherein the respective heat spreader comprises a thin metal strip having beveled edges and coated, by a thermally conductive dielectric, on at least one side of the metal strip.
5. The solar system of claim 4 , wherein the respective heat spreader is completely covered by the backsheet.
6. The solar system of claim 4 , wherein the respective heat spreader is mounted, via the thermally conductive dielectric, to the respective pair of ribbon interconnects with a thermal adhesive.
7. The solar system of claim 1 , wherein the substrate comprises a transparent substrate, and wherein the encapsulant is disposed between the backsheet and the transparent substrate.
8. A solar module, comprising:
a backsheet;
an electrical component disposed under the backsheet;
a pair of ribbon interconnects, each ribbon interconnect coupled to the electrical component and completely covered by the backsheet;
a heat spreader mounted directly above the electrical component;
an encapsulant, wherein the electrical component, the pair of ribbon interconnects, and the heat spreader are at least partially embedded in the encapsulant; and
a substrate below the encapsulant and the electrical component,
wherein a first portion of the encapsulant is disposed between the backsheet and the heat spreader,
wherein a second portion of the encapsulant is disposed between the backsheet and respective first sides of the ribbon interconnects,
wherein a third portion of the encapsulant is disposed between respective second sides of the ribbon interconnects and the substrate, and
wherein a fourth portion of the encapsulant is disposed between the electrical component and the substrate.
9. The solar module of claim 8 , wherein each of the pairs of ribbon interconnects is above the electrical component, and the electrical component is completely covered by the backsheet.
10. The solar module of claim 9 , wherein the electrical component is attached directly to each of the ribbon interconnects.
11. The solar module of claim 8 , wherein the heat spreader comprises a thin metal strip having beveled edges and coated, by a thermally conductive dielectric, on at least one side of the metal strip, and wherein the heat spreader is completely covered by the backsheet.
12. The solar module of claim 11 , wherein the heat spreader is mounted, via the thermally conductive dielectric, to each of the ribbon interconnects with a thermal adhesive.
13. The solar module of claim 8 , wherein the substrate comprises a transparent substrate, wherein the encapsulant is disposed between the backsheet and the transparent substrate.
14. A solar system comprising a package laminate, the package laminate comprising:
a backsheet;
a plurality of electrical components embedded within the package laminate under the backsheet;
a plurality of heat spreaders, each heat spreader mounted directly above a respective electrical component;
a plurality of ribbon interconnects, each ribbon interconnect electrically connected to a respective electrical component;
an encapsulant, wherein the electrical components, the ribbon interconnects, and the heat spreaders are at least partially embedded in the encapsulant; and
a substrate below the encapsulant and the plurality of electrical components,
wherein a first portion of the encapsulant is disposed between the backsheet and the plurality of heat spreader,
wherein a second portion of the encapsulant is disposed between the backsheet and respective first sides of the ribbon interconnects,
wherein a third portion of the encapsulant is disposed between respective second sides of the ribbon interconnects and the substrate, and
wherein a fourth portion of the encapsulant is disposed between the plurality of electrical components and the substrate.
15. The solar system of claim 14 , wherein the plurality of electrical components comprises a plurality of diodes, the system further comprising a string of solar cells configured to convert light to electricity, the string of solar cells disposed alongside and electrically coupled to the plurality of diodes.
16. The solar system of claim 14 , wherein the substrate comprises a transparent substrate, wherein the encapsulant is disposed between the backsheet and the transparent substrate.
17. The solar system of claim 14 , wherein each heat spreader has a width exceeding a width of the respective electrical component.
18. The solar system of claim 14 , wherein a top surface of the package laminate is defined at least in part by the backsheet, and wherein the top surface comprises a non-uniform surface profile.
19. The solar system of claim 18 , wherein each heat spreader comprises a thin metal strip having beveled edges.
20. The solar system of claim 19 , wherein the heat spreader is coated on at least one side of the metal strip by a thermally conductive dielectric.
21. The solar system of claim 1 , wherein the electrical component comprises a diode.
22. The solar module of claim 8 , wherein the electrical component comprises a diode.