IP Library Granted Patent US 9,671,428
Granted Patent B2
US 9,671,428 · App. 14/059,739 · Granted Jun 6, 2017

Contact spring for a testing base for the high current testing of an electronic component

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,671,428
App. No.
14/059,739
Granted
Jun 6, 2017
Kind
B2
Abstract

A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Claims (5)

1. A testing base for current testing, in particular high current testing, of an electronic component, having a multiplicity of contact springs wherein each contact spring is produced from a spring metal sheet of a predetermined thickness and possesses two identical, spaced apart, opposing lateral faces extending in spaced apart planes, and which has one spring arm and one testing arm with a testing tip, wherein the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by means of a relative movement between the testing base and the electronic component, a geometry of the lateral faces fulfills the following conditions:

a dimension L of a distance between a point Po and a point Pu is at least 2.3 times a length L 1 ; the point Po is located on a boundary line of the lateral face facing towards the electronic component, and comprises a distance from the testing tip of 3 to 5 times the length L 1 ; the point Po forms an apex of an angle in a range between 120° and 150°, one leg of the angle extends in a direction of a relative movement between the testing base and the electronic component towards the electronic component, and another leg of the angle cuts a boundary line of the lateral face facing away from the electronic component at the point Pu; and the length L 1 corresponds to a minimum thickness of the spring arm, as viewed in the direction of the relative movement between the testing base and the electronic component, wherein a first contact spring of the contact springs and a second contact spring of the contact springs are provided for contact surfaces of the electronic component, which first and second contact springs are arranged such that their lateral faces are located within a plane wherein the dimension L of the first contact spring differs from the dimension L of the second contact spring.

2. The testing base in accordance with claim 1 , wherein the dimension for the distance between the points Po and Pu for the first contact spring is at least 2.35 times the length L 1 , and for the second contact spring is at least 2.75 times the length L 1 .

3. The testing base for current testing in accordance with claim 1 , wherein the point Po comprises the distance from the testing tip of 4 times the length L 1 .

4. The testing base for current testing in accordance with claim 1 , wherein the point Po forms the apex angle of a 135 ° angle.

Assignments (2)
MERGER Recorded Dec 5, 2025
From: MULTITEST ELEKTRONISCHE SYSTEME GMBH
To: COHU GMBH
Reel/Frame 073901/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2013
From: GSCHWENDTBERGER, GERHARD; LEIKERMOSER, VOLKER; PETERMANN, MANUEL; FREY, MARCUS
To: MULTITEST ELEKTRONISCHE SYSTEME GMBH
Reel/Frame 031863/0939 →