Camera module with ambient light sensor
A camera module includes a shell, an ambient light sensor, and a lens module having a printed circuit board. The shell has a seat in its front surface, a first connector on its back surface, and circuits connecting the first connector to the seat by a laser direct structure technology. The ALS is soldered to the seat. The PCB is attached to the back surface of the shell and includes a second connector connected to the first connector.
1. A camera module, comprising:
a shell comprising a front surface, a back surface opposite to the front surface, and a side surface connecting the front surface and the back surface, the shell defining a receiving space in the back surface and a through hole in the front surface, the through hole communicating with the receiving space, the shell comprising a seat formed on the front surface, a first connector formed on the back surface, and circuits, the circuits formed on the front surface, the side surface, and the back surface and connecting the seat to the first connector;
an ambient light sensor (ALS) positioned on the front surface and soldered to the seat;
a printed circuit board (PCB) attached to the back surface and comprising a second connector connecting with the first connector; and
a lens positioned on and electrically connected with the PCB and received in the receiving space and the through hole;
wherein the seat, the first connector, and the circuits are formed by a laser direct structure (LDS) technology.
2. The camera module of claim 1 , wherein the shell defines a first recess in the front surface and a second recess in the side surface, the second recess intersecting with the first recess, the seat and the ALS are received in the first recess, the circuits are received in the first recess and the second recess, a depth of the first recess is greater than a total height of the seat and the ALS, and a depth of each of the first recess and the second recess is greater than a height of the circuits.
3. The camera module of claim 1 , wherein the shell comprises a first locating structure formed on the back surface, the PCB comprises a second locating structure, and the shell is located on the PCB by engagement between the first locating structure and the second locating structure.
4. The camera module of claim 3 , wherein the first locating structure comprises two poles extending up from the back surface, and the second locating structure defines two holes in the PCB corresponding to the poles in position and size.