MEMS package
A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.
1. A method of manufacturing a MEMS package comprising:
a) providing a multi-layer substrate formed of a first material, said substrate defining a bore through each layer, the bore having a fluid filter therein, the filter disposed within the multi-layer substrate;
b) substantially completely lining said bore through its entire length with a second material that is different from said first material; and
c) affixing a micromachined component having a fluid passageway formed therein to said substrate such that said bore and said fluid passageway are in fluid communication.
2. The method of manufacturing a MEMS package according to claim 1 further comprising:
a step of forming an electrical connection point on said substrate; and
a further step of electrically connecting said electrical connection point and said micromachined component.
3. A method of manufacturing a MEMS package comprising:
a) providing a multi-layer substrate formed of:
an electronic interface layer, said electronic interface layer comprising an electrical conductor and a bore defined through the electrical conductor and said electronic interface layer;
a fluidic channel layer, said fluidic channel layer defining a space therein; and
a fluid introduction layer, said fluid introduction layer having a fluid port formed therethrough; and
b) affixing an electrically active micromachined component having a fluid passageway formed therein to said multi-layer substrate, such that:
said electrical conductor of said electronic interface layer is electrically connected to said electrically active micromachined component; and
said bore of said electronic interface layer is in fluid communication with said fluid passageway of said electrically active micromachined component and in fluid communication with said space defined in said fluidic channel layer; and said space defined in said fluidic channel layer is in fluid communication with said fluid port of said fluid introduction layer.
4. A method of manufacturing a MEMS package comprising:
a) providing a substrate formed of a first material, said substrate defining a bore therein, said bore being substantially completely lined with a second material that is different from said first material, said substrate further having an electrical conductor formed thereon, said bore further having a fluid filter therein, the filter disposed within the substrate;
b) providing an electrically active micromachined component having a fluid passageway formed therein;
c) affixing said component to said substrate such that said bore and said fluid passageway are in fluid communication via a substantially leak-tight connection therebetween; and
d) electrically connecting said electrically active micromachined component to said electrical conductor.
5. The method of manufacturing a MEMS package according to claim 4 wherein steps c) and d) are performed substantially simultaneously.
6. A method of manufacturing a MEMS package comprising:
a) providing a multi-layer substrate formed of:
an electronic interface layer, said electronic interface layer comprising an electrical conductor and a bore defined through said electronic interface layer;
a fluidic channel layer, said fluidic channel layer defining a space therein;
a fluid introduction layer, said fluid introduction layer defining a fluid port;
a filtration layer between said fluid introduction layer and said fluidic channel layer; and
b) affixing an electrically active micromachined component having a fluid passageway formed therein to said multi-layer substrate, such that:
said electrical conductor of said electronic interface layer is electrically connected to said electrically active micromachined component; and
said bore of said electronic interface layer is in fluid communication with said fluid passageway of said electrically active micromachined component and in fluid communication with said space defined in said fluidic channel layer; and said space defined in said fluidic channel layer is in fluid communication with said fluid port of said fluid introduction layer.