Transferring an antenna to an RFID inlay substrate
View Patent ↗Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.
1. A method of making a transponder comprising an inlay substrate, an RFID chip and an antenna structure, characterized by:
forming a wide trench in the inlay substrate for accepting the antenna structure; and
after forming the trench, disposing the antenna structure in the trench;
wherein:
the transponder is located at one of a plurality of transponder sites on the inlay substrate; and
further comprising:
preparing a plurality of transponder sites on an inlay substrate, each transponder site comprising a defined area of the inlay substrate;
forming a plurality of antenna structures on an antenna substrate which is separate from the inlay substrate; and
removing given antenna structures from the antenna substrate and transferring them to selected ones of the transponder sites.
2. The method of claim 1 , wherein:
the antenna comprises a number of turns; and
the trench is several times wider than a cross-dimension of a single turn of the antenna structure.
3. The method of claim 1 , wherein:
the antenna comprises a number of turns; and
the trench is approximately as deep as a cross-dimension of a single turn of the antenna structure.
4. The method of claim 1 , wherein:
the antenna structure comprises a wire, a foil or a ribbon.
5. The method of claim 1 , wherein:
turns of the antenna structure are laid into the trench sequentially, turn-by-turn.
6. The method of claim 1 , wherein;
the turns of the antenna structure are scribed into the trench using a sonotrode tool.
7. The method of claim 1 , wherein:
the antenna structure is preformed, and disposed as a single unit into the trench.
8. The method of claim 1 , further comprising:
connecting end portions of the antenna structure with terminals of the chip.
9. The method of claim 1 , further comprising:
dispensing glue in the trench.
10. The method of claim 1 , further comprising:
disposing a layer of adhesive over the inlay substrate.
11. The method of claim 1 , further comprising:
forming a recess in the inlay substrate; and
installing an RFID chip in the recess.
12. The method of claim 1 , wherein preparing a plurality of transponder sites comprises:
installing RFID chips in recesses at the transponder sites.
13. The method of claim 1 , wherein:
a plurality of antenna structures are transferred one-by-one from the antenna substrate to selected ones of the transponder sites.
14. The method of claim 1 , wherein:
a plurality of antenna structures are transferred all at once from the antenna substrate to selected ones of the transponder sites.
15. The method of claim 1 , wherein transferring comprises a contact transfer process.
16. The method of claim 1 , wherein:
the antenna substrate is formed of a material which is different from the material of the inlay substrate.