IP Library Granted Patent US 9,646,599
Granted Patent B2
US 9,646,599 · App. 14/062,532 · Granted May 9, 2017

Remoldable contour sensor holder

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Quick Facts
Patent No.
US 9,646,599
App. No.
14/062,532
Granted
May 9, 2017
Kind
B2
Abstract

A sensor assembly for inspecting a part, the sensor assembly comprising a sensor for sensing a defect of the part and a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part. The housing is formed of a moldable material and may be molded into a shape that conforms to a contour of the part when a stimulus is applied to the housing and may harden into the shape when the stimulus is removed from the housing.

Claims (40)

1. A sensor assembly for inspecting a part, the sensor assembly comprising:

a sensor for sensing a defect of the part;

a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part, the remoldable housing being formed of a moldable material that is:

molded into a shape that forms a cavity and conforms to a contour of the part when a stimulus is applied to the remoldable housing, the cavity extending completely through the remoldable housing and having a first end opening for receiving at least a portion of the sleeve and at least a portion of the sensor therein and a second end opening for allowing a sensing signal to pass therethrough; and

hardened into the shape when the stimulus is removed from the remoldable housing; and

a sleeve having a first opening for receiving at least a portion of the sensor therein and a second opening for transmitting or receiving the sensing signal therethrough, the sleeve being configurable to be positioned at least partially inside the cavity.

2. The sensor assembly of claim 1 , wherein the remoldable housing is configurable to be remolded until the sensor is at an optimal position for sensing the defect.

3. The sensor assembly of claim 1 , further comprising:

a thin layer of material configured to overlay the second opening for preventing the remoldable housing from entering the sleeve when the sleeve is inserted into the cavity, the thin layer of material being configurable to be at least partially removed when the sleeve is at least partially in the cavity.

4. The sensor assembly of claim 1 , wherein the second opening is on a non-chamfered end of the sleeve.

5. The sensor assembly of claim 1 , wherein the remoldable housing is further configurable to receive a couplant for improving the signal.

6. The sensor assembly of claim 1 , further comprising a stimulus source integrated with the remoldable housing, the stimulus source being configurable to apply the stimulus to the remoldable housing.

7. The sensor assembly of claim 6 , wherein the stimulus source is embedded in the remoldable housing.

8. The sensor assembly of claim 1 , wherein the stimulus is heat.

9. A method for inspecting a part, the method comprising the steps of:

applying a stimulus to an at least partially remoldable housing;

molding the at least partially remoldable housing to form a cavity extending completely through the remoldable housing and having a first end opening for receiving at least a portion of a sleeve and at least a portion of a sensor therein and a second end opening for allowing a sensing signal to pass therethrough;

positioning the sleeve at least partially in the cavity;

placing the sensor at least partially in the sleeve such that the sensor extends at least partially into the cavity;

molding the at least partially remoldable housing to conform to a contour of the part such that the sensor is at a position to transmit or receive a signal for sensing a defect of the part;

detecting the signal;

remolding the at least partially remoldable housing into a modified shape for repositioning the sleeve and the sensor until an optimized signal is achieved; and

removing the stimulus to harden the at least partially remoldable housing into the modified shape.

10. The method of claim 9 , further comprising the step of forming the at least partially remoldable housing from a supply of shape memory material.

11. The method of claim 9 , further comprising the step of:

remolding the at least partially remoldable housing into a second modified shape when the contour changes to maintain the optimized signal.

12. A sensor assembly for inspecting a part, the sensor assembly comprising:

a sensor for sensing a defect of the part;

a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part, the remoldable housing being formed of a moldable material that may:

be molded into a shape that forms a cavity for receiving at least a portion of the sensor therein and conforms to a contour of the part when a stimulus is applied to the remoldable housing; and

harden into the shape when the stimulus is removed from the remoldable housing;

a sleeve having a first opening for receiving at least a portion of the sensor therein and a second opening for allowing a sensing signal to be transmitted or received therethrough, the sleeve being configurable to be positioned at least partially inside the cavity; and

a thin layer of material configured to overlay the second opening of the sleeve for preventing the remoldable housing from entering the sleeve when the sleeve is inserted into the cavity, the thin layer of material being configurable to be at least partially removed when the sleeve is at least partially in the cavity.

13. A sensor assembly for inspecting a part, the sensor assembly comprising:

a sensor for sensing a defect of the part;

a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part, the remoldable housing being formed of a moldable material that may:

be molded into a shape that forms a cavity and conforms to a contour of the part when a stimulus is applied to the remoldable housing, the cavity extending through the remoldable housing and having a first end for receiving at least a portion of the sensor therein and a second end for allowing a sensing signal to pass therethrough; and

harden into the shape when the stimulus is removed from the remoldable housing;

a sleeve having a first opening for receiving at least a portion of the sensor therein and a second opening for transmitting or receiving a sensing signal therethrough, the sleeve being configurable to be positioned at least partially inside the cavity; and

a thin layer of material configured to overlay the second opening for preventing the remoldable housing from entering the sleeve when the sleeve is inserted into the cavity, the thin layer of material being configurable to be at least partially removed when the sleeve is at least partially in the cavity.

Assignments (15)
RELEASE OF SECURITY INTEREST Recorded Dec 11, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073932/0669 →
RELEASE OF SECURITY INTEREST Recorded Dec 10, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073900/0356 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065772/0456 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
RELEASE OF SECURITY INTEREST Recorded Nov 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 061995/0281 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2020
From: BANK OF AMERICA, N.A.
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 054230/0578 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053993/0569 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053993/0505 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053983/0350 →
SECURITY INTEREST Recorded Apr 17, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 052433/0843 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 24, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 052004/0929 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2013
From: GAYLE, DAVID MICHAEL; DONAR, ADAM JOSEPH; PILLA, NICHOLAS JOHN
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 031472/0966 →