LED lighting assemblies with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 ° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A lighting assembly, comprising:
a printed circuit board;
one or more light emifting diode (LED) inclusive packages disposed on the printed circuit board;
conductors electrically connected to the printed circuit board;
one or more light-transmissive cover disposed over the one or more LED package;
an overmolding encapsulating a portion of the cover and the printed circuit board over at least portions of the printed circuit board proximate the one or more LED package, said overmolding forming at least one exterior surface of the lighting assembly; and
wherein the overmolding does not cover at least a light output aperture of the LED package and a portion of the cover overlying the LED package.
2. The lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive cover each encloses more than one LED package.
3. The lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive cover includes a base region disposed on the printed circuit board and wherein the overmolding contacts the base region without fully covering the one or more light-transmissive covers.
4. The lighting assembly as set forth in claim 1 , wherein the overmolding material has a melting temperature preferably between about 310° C. and about 500° C.
5. The lighting assembly as set forth in claim 4 , wherein the overmolding material has a melting temperature more preferably between about 310° C. and about 350° C.
6. The lighting assembly as set forth in claim 1 , wherein the overmolding material has a thermal conductivity greater than 1 W/m-K.
7. The lighting assembly as set forth in claim 1 , wherein the one or more LEDs comprise phosphor disposed thereon.
8. The lighting assembly as set forth in claim 1 , wherein the one or more light-transmissive covers comprise phosphor disposed thereon.
9. The lighting apparatus of claim 1 wherein said overmolding does not contact said one or more LED.
10. A lighting assembly, comprising:
a printed circuit board;
one or more light emitting diode (LED) inclusive packages disposed on the printed circuit board;
conductors electrically connected to the printed circuit board;
one or more light-transmissive cover disposed over the one or more LED package;
an overmolding encapsulating the printed circuit board over at least portions of the printed circuit board proximate the one or more LED package and without contacting the one or more LED package; and
wherein the overmolding does not cover at least a light output aperture of the LED and a portion of the one or more light-transmissive cover overlying the one or more LED package.
11. A lighting assembly, comprising:
a printed circuit board;
one or more light emitting diodes (LEDs) inclusive packages disposed on the printed circuit board;
conductors electrically connected to the printed circuit board;
a light-transmissive cover disposed over the one or more packages, said cover having a base region; and
an overmolding encapsulating a portion of the printed circuit board and contacting at least one exterior surface of the light-transmissive cover only at the base region thereof, and forming an exterior surface of the lighting assembly.
12. The light assembly of claim 11 wherein the portion of the printed circuit board is a backside portion.
13. The lighting assembly of claim 11 wherein the portion of the printed circuit board is a front side portion.
14. A lighting assembly comprising:
a printed circuit board;
a plurality of light emitting diodes (LEDs) inclusive packages disposed on a front surface of the printed circuit board;
a light-transmissive cover secured to said printed circuit board and overlying said packages; and
an overmolding encapsulating at least a portion of the printed circuit board, said overmolding forming a planar exterior surface of the lighting assembly configured for mounting on a planar substrate, and wherein said light-transmissive over includes an interior surface having at least a portion spaced above said printed circuit board a distance greater than the overmolding adjacent said light-transmissive cover.
15. The lighting assembly of claim 14 further comprising power conditioning electronics, said power conditioning electronics disposed within the overmolding.
16. The lighting assembly of claim 15 wherein said power conditioning electronics are disposed on a rear surface of the printed circuit board.
17. The lighting assembly of claim 14 wherein said overmolding has a thermal conductivity greater than about 1w/mK.
18. The lighting assembly of claim 14 further comprising a plurality of lenses and wherein each LED package includes an associated lens.
19. The lighting assembly of claim 14 wherein the printed circuit board does not include a metal core.
20. The lighting assembly of claim 19 wherein there is no metal heat sink in the assembly.
21. The lighting assembly of claim 14 wherein the cover includes an optical coating.
22. The lighting assembly of claim 14 wherein the light-transmissive cover consists of a single cover.
23. The lighting assembly of claim 14 wherein a portion of said overmolding engages said cover.