WAFER-LEVEL PACKAGES HAVING VOIDS FOR OPTO-ELECTRONIC DEVICES

1 . A method for forming a semiconductor device package, comprising:

mounting at least one semiconductor die on an adhesive tape substrate;

mounting at least one sacrificial structure made of a sacrificial material on the adhesive tape substrate;

applying molding material on the adhesive tape substrate to embed at least a portion of the at least one semiconductor die and at least a portion of the at least one sacrificial structure;

removing the adhesive tape substrate to define a package assembly having at least a portion of the at least one semiconductor die and at least a portion of the at least one sacrificial structure on a first surface of the package assembly;

forming at least one metal redistribution layer having a plurality of conductive circuit paths on the first surface of the package assembly, at least a portion of the conductive circuit paths in electrical contact with one or more signal pads of the semiconductor die; and

removing at least a portion of the sacrificial material embedded in the molding material to form at least one void in the molding material having a shape corresponding to a shape of the portion of the sacrificial material embedded in the molding material.

2 . The method of claim 1 , wherein the step of removing at least a portion of the sacrificial material embedded in the molding material comprises one of dissolving, etching and thermally decomposing the portion of the sacrificial material embedded in the molding material.

3 . The method of claim 1 , wherein:

the step of mounting at least one sacrificial structure comprises mounting a first sacrificial structure having a length extending in a direction substantially normal to the adhesive tape substrate;

the step of applying molding material comprises applying a layer of molding material having a thickness greater than the length of the first sacrificial structure and extending between the first surface of the package assembly and a second surface of the package assembly; and

the at least one void includes a first void having an opening on the first surface and a bottom between the first surface and the second surface.

4 . The method of claim 3 , wherein an area of the bottom of the first void is greater than an area of the opening of the first void.

5 . The method of claim 1 , wherein:

the step of mounting at least one sacrificial structure comprises mounting a first sacrificial structure having a length extending in a direction substantially normal to the adhesive tape substrate;

the step of applying molding material comprises applying a layer of molding material having a thickness less than the length of the first sacrificial structure and extending between the first surface of the package assembly and a second surface of the package assembly; and

the at least one void includes a first void defining a first aperture extending completely through the layer of molding material between the first surface and the second surface.

6 . The method of claim 5 , further comprising mounting an opto-electronic communication device on one of the first and second surfaces of the package assembly, the opto-electronic communication device having an optical axis aligned with the first aperture, the opto-electronic communication device making a plurality of electrical signal connections with one of the first and second metal redistribution layers.

7 . The method of claim 6 , further comprising inserting an end of an optical fiber into the first aperture.

8 . The method of claim 6 , wherein:

the step of mounting at least one sacrificial structure comprises mounting a second sacrificial structure having a length extending in a direction substantially normal to the adhesive tape substrate; and

the at least one void further includes a second void having a shape corresponding to a shape of the portion of the sacrificial material of the second sacrificial structure embedded in the molding material.

9 . The method of claim 8 , further comprising providing a connector assembly having an end of an optical fiber cable retained therein, the connector assembly having a pin mechanically mateable with the second void, the connector assembly having an optical axis alignable with the first aperture by mating the pin with the second void.

10 . The method of claim 1 , wherein the step of mounting at least one semiconductor die on an adhesive tape substrate comprises mounting an opto-electronic communication device on the adhesive tape.

11 . The method of claim 10 , wherein the opto-electronic communication device includes an opto-electronic transmitter device and an opto-electronic receiver device.

12 . The method of claim 10 , further comprising providing a connector assembly having an end of an optical fiber cable retained therein, the connector assembly having a pin mechanically mateable with the at least one void, the connector assembly having an optical axis alignable with an optical axis of the opto-electronic communication device by mating the pin with the at least one void.

13 . The method of claim 10 , further comprising providing a lens device, the lens device having a pin mechanically mateable with the at least one void, the lens device having an optical axis alignable with an optical axis of the opto-electronic communication device by mating the pin with the at least one void.

14 . The method of claim 10 , further comprising providing a reflector device, the reflector device having a pin mechanically mateable with the at least one void, the reflector device having an optical axis alignable with an optical axis of the opto-electronic communication device by mating the pin with the at least one void.

15 . The method of claim 1 , further comprising inserting a fastening member having a shape substantially complementary to the shape of the at least one void into the at least one void to mechanically engage the fastening member with the package assembly.

16 . The method of claim 15 , wherein:

the at least one void includes a first void having an opening on the first surface and a bottom between the first surface and the second surface; and

inserting a fastening member comprises snap-engaging the fastening member with the first void.

17 . The method of claim 1 , wherein the at least one void defines a cavity having an opening on the first surface and having a bottom between the first surface and the second surface, the method further comprising:

mounting an opto-electronic transceiver device on the first surface, the optical transceiver device straddling the first surface and the void, the opto-electronic transceiver device making a plurality of electrical signal connections with the first metal redistribution layer, the opto-electronic transceiver device having optical transmit and receive axes aligned with a region of the cavity.

18 . The method of claim 1 , wherein the at least one void defines a cavity having an opening on the first surface and a bottom between the first surface and the second surface, the method further comprising:

mounting a cover on the first surface, the cover straddling the first surface and the cavity; and

filling the cavity with a liquid adhesive.

19 . The method of claim 1 , wherein the at least one void defines a channel having an opening on the first surface, a bottom between the first surface and the second surface, and at least one reflector surface oriented at an oblique angle with respect to the first surface, the method further comprising:

applying an optically reflective material to the at least one reflector surface to form a reflective surface; and

mounting an opto-electronic device on the first surface, the opto-electronic device making a plurality of electrical signal connections with the first metal redistribution layer, the opto-electronic device having an optical axis aligned with the reflective surface.

20 . The method of claim 1 , wherein the at least one void defines a cavity having an opening on the first surface and a bottom between the first surface and the second surface, the method further comprising:

mounting a thermally conductive member in the cavity; and

mounting an active electronic device on the first surface, the active electronic device straddling the first surface and the cavity, the active electronic device making a plurality of electrical signal connections with the first metal redistribution layer, the active electronic device making a thermally conductive connection with the thermally conductive member.