CIRCUIT BOARD SYSTEM COMPRISING A SPRING FASTENED ELEMENT
A circuit board system according to the invention includes a circuit board ( 101 ), an element ( 102 ) e.g. a heat sink mechanically supported with respect to the circuit board, and a spring-fastener ( 106 ) arranged to mechanically support the element. The spring-fastener includes a pressing portion pressing the element and a latching portion ( 107 ) extending from an end of the pressing portion and engaging with a securing member ( 108 ) that is fixed with respect to the circuit board. The latching portion is formed to constitute a loop ( 109 ) and the securing member extends through the loop. The loop is formed so that disengaging the latching portion from the securing member requires changing the shape of the loop against the spring-force of the material of the latching portion. Therefore, the risk of unintentional disengagement of the spring-fastener is reduced.
1 . A circuit board system comprising:
a circuit board,
at least one element mechanically supported with respect to the circuit board, and
a spring-fastener arranged to mechanically support the at least one element with respect to the circuit board, the spring-fastener comprising a pressing portion pressing the at least one element and a latching portion extending from an end of the pressing portion and engaging with a securing member fixed with respect to the circuit board,
wherein the latching portion is formed to constitute a loop and the securing member extends through the loop, the latching portion being formed to constitute the loop so that disengaging the latching portion from the securing member requires changing the shape of the loop against spring-force of material of the latching portion.
2 . A circuit board system according to claim 1 , wherein the latching portion is arranged to constitute the loop so that a tip of the latching portion faces towards the circuit board and a passage to and from the loop is capable of being widened by bending the tip of the latching portion towards a center of the loop.
3 . A circuit board system according to claim 1 , wherein the latching portion is arranged to constitute the loop so that a distance (T) from a tip of the latching portion to another section of the latching portion is less than a diameter (D) of the securing member.
4 . A circuit board system according to claim 1 , wherein the latching portion is arranged to constitute the loop so that disengaging the latching portion from the securing member requires twisting the loop is against torsional spring-force of the material the latching portion.
5 . A circuit board system according to claim 1 , wherein the latching portion is arranged to constitute the loop so that a tip of the latching portion constitutes an opening arm for opening the loop by twisting the opening arm.
6 . A circuit board system according to claim 1 , wherein the element is a heat sink having a first surface in heat conducting relation with an electronic component between the heat sink and the circuit board, the pressing portion of the spring-fastener pressing the heat sink against the electronic component.
7 . A circuit board system according to claim 2 , wherein the element is a heat sink having a first surface in heat conducting relation with an electronic component between the heat sink and the circuit board, the pressing portion of the spring-fastener pressing the heat sink against the electronic component.
8 . A circuit board system according to claim 3 , wherein the element is a heat sink having a first surface in heat conducting relation with an electronic component between the heat sink and the circuit board, the pressing portion of the spring-fastener pressing the heat sink against the electronic component.
9 . A circuit board system according to claim 4 , wherein the element is a heat sink having a first surface in heat conducting relation with an electronic component between the heat sink and the circuit board, the pressing portion of the spring-fastener pressing the heat sink against the electronic component.
10 . A circuit board system according to claim 5 , wherein the element is a heat sink having a first surface in heat conducting relation with an electronic component between the heat sink and the circuit board, the pressing portion of the spring-fastener pressing the heat sink against the electronic component.
11 . A circuit board system according to claim 1 , wherein the at least one element is at least one electrical component electrically connected to the circuit board and the pressing portion of the spring-fastener constitutes at least a part of a support arm system mechanically supporting the at least one electrical component.
12 . A circuit board system according to claim 2 , wherein the at least one element is at least one electrical component electrically connected to the circuit board and the pressing portion of the spring-fastener constitutes at least a part of a support arm system mechanically supporting the at least one electrical component.
13 . A circuit board system according to claim 3 , wherein the at least one element is at least one electrical component electrically connected to the circuit board and the pressing portion of the spring-fastener constitutes at least a part of a support arm system mechanically supporting the at least one electrical component.
14 . A circuit board system according to claim 4 , wherein the at least one element is at least one electrical component electrically connected to the circuit board and the pressing portion of the spring-fastener constitutes at least a part of a support arm system mechanically supporting the at least one electrical component.
15 . A circuit board system according to claim 5 , wherein the at least one element is at least one electrical component electrically connected to the circuit board and the pressing portion of the spring-fastener constitutes at least a part of a support arm system mechanically supporting the at least one electrical component.
16 . A circuit board system according to claim 11 , wherein each of the at least one electrical component is an electrolytic capacitor.
17 . A circuit board system according to claim 12 , wherein each of the at least one electrical component is an electrolytic capacitor.
18 . A circuit board system according to claim 13 , wherein each of the at least one electrical component is an electrolytic capacitor.
19 . A circuit board system according to claim 1 , wherein the circuit board system comprises a processing system for supporting at least one of the following data transfer protocols: Internet Protocol “IP”, Ethernet protocol, MultiProtocol Label Switching “MPLS” protocol, Asynchronous Transfer Mode “ATM”.