Electronics module

1. An electronics module comprising:

a module housing including a base structure and a plurality of side walls;

a module cover contacting said side walls, the module cover being connected to the module housing via at least one fastener;

the module housing including at least one fastener boss for receiving the at least one fastener; each of said fastener bosses including a fastener hole protruding partially into the fastener boss and a vent hole connecting said fastener hole to an opening on a surface of said fastener boss exterior to said module housing;

a sealant disposed in said fastener boss, thereby preventing external air from entering the electronics module through a fastener connection.

2. The module of claim 1 , wherein the sealant is a cured liquid sealant.

3. The module of claim 2 , wherein said cured liquid sealant is of viscous in an uncured state such that said liquid sealant does not run into said fastener hole.

4. The module of claim 1 , wherein the sealant is an adhesive and wherein the sealant adheres at least one external surface of the at least one fastener to an internal surface of the at least one fastener boss.

5. The module of claim 4 , wherein the at least one fastener is a non-cylindrical fastener.

6. The module of claim 4 , wherein the at least one fastener is a threaded fastener and wherein said interior surface of the at least one boss includes threading complimentary to threading of said threaded fastener.

7. The module of claim 4 , wherein the at least one fastener is a threaded fastener and wherein said interior surface of the at least one boss lacks threading such that insertion of the at least one fastener creates complimentary threading on said interior surface.

8. The module of claim 1 , wherein each vent hole is aligned with the corresponding fastener hole.

9. The module of claim 1 , wherein said sealant further comprises a sealant bulge protruding from a first end of said fastener boss such that said sealant bulge contacts said cover and said fastener boss.

10. The module of claim 9 , wherein said sealant contacts said cover along a full circumference of said fastener hole, thereby sealing said module at said at least one fastener.

11. The module of claim 1 , wherein an axis defined by said vent hole is not aligned with an axis defined by said fastener hole.

12. A method for sealing an electronics module housing comprising the steps of:

disposing a liquid sealant on a first end of a fastener boss;

passing a fastener through a cover of said module housing, and receiving the fastener in said fastener boss;

venting air exterior to said electronics module housing from said fastener boss through a vent; and

allowing said liquid sealant to cure, thereby sealing said electronics module housing.

13. The method of claim 12 further comprising the step of sealing a joint between a cover of said electronics module and a module housing of said electronics module via at least one of a sealant bonding agent and a weld.

14. The method of claim 12 , wherein the step of passing a fastener through a cover of said module housing and receiving the fastener in said fastener boss further comprises displacing said liquid sealant into said fastener boss thereby forcing air in said fastener boss into a vent in said fastener boss.

15. The method of claim 12 , wherein the step of allowing said liquid sealant to cure further comprises adhering at least one exterior surface of said fastener to at least one interior surface of said fastener boss.

16. The method of claim 12 , wherein said step of passing said fastener through said cover of said module housing further comprises rotating said fastener such that threads of said fastener create complimentary threads within said fastener boss.