IP Library Granted Patent US 9,235,114
Granted Patent B2
US 9,235,114 · App. 14/066,398 · Granted Jan 12, 2016

Reflective mask and method for manufacturing the same

Inventor: Takeshi Kagawa (Kuwana, JP)
Assignee: FUJITSU SEMICONDUCTOR LIMITED
G03F1/24
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Quick Facts
Patent No.
US 9,235,114
App. No.
14/066,398
Granted
Jan 12, 2016
Kind
B2
Abstract

A reflective mask includes a substrate and a multilayer reflective film formed on the substrate. An absorption pattern is formed on the multilayer reflective film. A recess is formed in the multilayer reflective film in a peripheral region of the absorption pattern.

Claims (25)

1. A reflective mask comprising:

a substrate;

a multilayer reflective film formed on the substrate;

an absorption pattern formed on the multilayer reflective film;

an exposed surface portion of the multilayer reflective film formed in a peripheral region of the absorption pattern; and

a recess formed in the multilayer reflective film in the peripheral region of the absorption pattern.

2. The reflective mask according to claim 1 , wherein the recess has a planar shape identical to or larger than that of the absorption pattern.

3. The reflective mask according to claim 1 , wherein the recess is configured to reflect extreme ultraviolet light at a reflectance of 40 to 50%.

4. The reflective mask according to claim 1 , wherein the absorption pattern corresponds to a circuit pattern arranged at a pitch of 352 nm or greater.

5. The reflective mask according to claim 1 , wherein the recess is spaced apart from the absorption pattern by a distance of 72 nm to 128 nm.

6. The reflective mask according to claim 1 , wherein the substrate includes

a circuit pattern region,

a scribe region surrounding the circuit pattern region, and

a shield region surrounding the scribe region, and

the absorption pattern and the recess are arranged in the circuit pattern region.

7. The reflective mask according to claim 1 , further comprising

a further absorption pattern formed on the multilayer reflective film,

wherein the exposed surface portion of the multilayer reflective film is formed in a further peripheral region of the further absorption pattern.

8. The reflective mask according to claim 1 , further comprising

a further recess formed in the multilayer reflective film in the peripheral region of the absorption pattern, wherein the further recess is located opposite to the recess with respect to the absorption pattern along a plane that is parallel to a normal of a surface of the substrate.

9. A method for manufacturing a reflective mask, comprising:

forming a multilayer reflective film on a substrate;

forming an absorption layer on the multilayer reflective film;

patterning the absorption layer to form an absorption pattern; and

forming a recess in the multilayer reflective film in a peripheral region of the absorption pattern such that an exposed surface portion of the multilayer reflective film is formed in the peripheral region of the absorption pattern.

Assignments (2)
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2013
From: KAGAWA, TAKESHI
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 031503/0950 →
Priority Claims (1)
JP 2012-245267 · Nov 7, 2012 · national
Continuity (1)
Related Publication 20140127613A1 · May 8, 2014