Printed circuit board structure
View Patent ↗A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions comprises a plurality of empty regions which are spaced from each other. A space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with cooper.
1. A printed circuit board (PCB) structure comprising:
a base layer;
an insulation layer; and
a signal layer sandwiched between the base layer and the insulation layer;
wherein the signal layer comprises a plurality of conductive regions; the conductive regions are used for providing a current reflowing path; each of the conductive regions comprises a plurality of empty regions spaced from each other; a space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with copper.
2. The PCB structure of claim 1 , wherein the empty regions is arranged in a grid patterns.
3. The PCB structure of claim 1 , wherein a shape of the empty regions is a substantially polygonal.
4. The PCB structure of claim 1 , wherein a shape of the empty region is adjustable for satisfying different requirements.
5. The PCB structure of claim 1 , wherein the size of the empty region is adjustable for satisfying different requirements.