IP Library Granted Patent US 9,951,566
Granted Patent B1
US 9,951,566 · App. 14/067,831 · Granted Apr 24, 2018

Superabrasive elements, methods of manufacturing, and drill bits including same

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Quick Facts
Patent No.
US 9,951,566
App. No.
14/067,831
Granted
Apr 24, 2018
Kind
B1
Abstract

Methods of manufacturing a superabrasive element are disclosed. In one embodiment, a substrate and a preformed superabrasive volume may be at least partially surrounded by an enclosure and the enclosure may be sealed in an inert environment. Further, the enclosure may be exposed to an elevated pressure and preformed superabrasive volume may be affixed to the substrate. Polycrystalline diamond elements are disclosed. In one embodiment, a polycrystalline diamond element may comprise a preformed polycrystalline diamond volume bonded to a substrate by a braze material. Optionally, such a polycrystalline diamond element may exhibit a compressive stress. Rotary drill bit for drilling a subterranean formation and including at least one superabrasive element are also disclosed.

Claims (37)

1. A polycrystalline diamond compact, comprising:

a cemented carbide substrate including at least one material selected from the group consisting of iron, nickel, and cobalt; and

a coherent matrix of bonded diamond grains defining a pre-sintered polycrystalline diamond body with a plurality of interstitial regions between the coherent matrix of bonded diamond grains, the pre-sintered polycrystalline diamond body including:

an upper surface;

a nonplanar interfacial surface;

a side surface extending between the upper surface and the non-planar interfacial surface; and

a chamfer extending between the side surface and the upper surface, wherein the chamfer has a length less than a length of the side surface;

wherein the nonplanar interfacial surface of the pre-sintered polycrystalline diamond body is bonded directly to the substrate and the pre-sintered polycrystalline diamond body further comprises:

a first region extending inwardly from the nonplanar interfacial surface and including the at least one material; and

a leached second region from which the at least one material has been at least partially removed, the second region extending inwardly from the upper surface.

2. The polycrystalline diamond compact of claim 1 wherein the at least one material has infiltrated the first region.

3. The polycrystalline diamond compact of claim 2 wherein the at least one material has infiltrated the pre-sintered polycrystalline diamond body from the substrate.

4. The polycrystalline diamond compact of claim 1 wherein the pre-sintered polycrystalline diamond body was initially formed with a catalyst that was subsequently leached therefrom.

5. The polycrystalline diamond compact of claim 1 wherein the substrate includes a tungsten carbide.

6. The polycrystalline diamond compact of claim 1 wherein the nonplanar interfacial surface of the pre-sintered polycrystalline diamond body exhibits a selected nonplanar topography.

7. The polycrystalline diamond compact of claim 6 wherein the at least one material is selected from the group consisting of nickel and cobalt.

8. The polycrystalline diamond compact of claim 7 wherein the at least one material comprises cobalt.

9. The polycrystalline diamond compact of claim 7 wherein the pre-sintered polycrystalline diamond body is substantially cylindrical.

10. The polycrystalline diamond compact of claim 7 wherein the substrate is substantially cylindrical.

11. A rotary drill bit, comprising:

a bit body configured to engage a subterranean formation; and

a plurality of polycrystalline diamond cutting elements affixed to the bit body, at least one of the polycrystalline diamond cutting elements including:

a cemented carbide substrate including at least one material selected from the group consisting of iron, nickel, and cobalt; and

a coherent matrix of bonded diamond grains defining a pre-sintered polycrystalline diamond body with a plurality of interstitial regions between the coherent matrix of bonded diamond grains, the pre-sintered polycrystalline diamond body including: an upper surface;

a nonplanar interfacial surface;

a side surface extending between the upper surface and the non-planar interfacial surface; and

a chamfer extending between the side surface and the upper surface wherein the chamfer has a length less than a length of the side surface;

wherein the nonplanar interfacial surface of the pre-sintered polycrystalline diamond body is bonded directly to the substrate and the pre-sintered polycrystalline diamond body further comprises:

a first region extending inwardly from the nonplanar interfacial surface and including the at least one material; and

a leached second region from which the at least one material has been at least partially removed, the second region extending inwardly from the upper surface.

12. The drill bit of claim 11 wherein the pre-sintered polycrystalline diamond body was initially formed with a catalyst that was subsequently leached therefrom.

13. The drill bit of claim 11 wherein the cemented carbide substrate includes a cobalt-cemented tungsten carbide substrate.

14. The drill bit of claim 11 wherein the nonplanar interfacial surface of the pre-sintered polycrystalline diamond body exhibits a selected nonplanar topography.

15. The drill bit of claim 11 wherein the at least one material is selected from the group consisting of nickel and cobalt.

16. The drill bit of claim 15 wherein the at least one material is cobalt.

17. The drill bit of claim 16 wherein the cobalt is leached from the leached second region.

18. The polycrystalline diamond compact of claim 1 wherein the pre-sintered polycrystalline diamond body includes a single diamond layer.

Assignments (5)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded Nov 6, 2019
From: APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 050941/0695 →