Modular printhead for OLED printing
View Patent ↗The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.
1. A method for forming an integrated printhead device, the method comprising:
forming a plurality of micropores on a distal surface of a printhead die;
forming a heater on the proximal surface of the printhead die;
forming at least one electrical trace on a support structure;
connecting the support structure to one of the electrical heater or the printhead die through a connection joint;
wherein the support structure provides a solid state connection between an electrical supply source and the heater and wherein the connection joint provides a path for said connection.
2. The method of claim 1 , wherein the at least one micropore defines a blind micropore.
3. The method of claim 1 , wherein the printhead die comprises a silicon material.
4. The method of claim 1 , wherein the support structure further comprises a ceramic material.
5. The method of claim 1 , wherein the distal surface of the printhead is configured to define a flatness tolerance of about 5-10 micron.
6. The method of claim 1 , further comprising connecting the heater to a complementary supply source through a complementary electrical trace.
7. The method of claim 1 , wherein the integrated printhead chip defines a solid state device excluding external wiring.
8. The method of claim 1 , further comprising forming a trench through the printhead die.
9. The method of claim 1 , further comprising connecting the support structure to at least one of the heater or the printhead die through a plurality connection joints.
10. The method of claim 1 , further comprising forming a connection joint by forming an under-bump metal (UBM) at a connection site on the heater, depositing a solder bump on the UMB and interposing a package pad between the solder bump and the support structure.