Ultracapacitors employing phase change materials

1. A method comprising:

receiving a phase change metal alloy material;

receiving ultracapacitor components comprising a separator, a support structure and a current collector;

forming the separator from a phase change metal alloy mesh adjacent to a dielectric membrane; and

arranging at least some of the phase change metal alloy material adjacent to the ultracapacitor components to form one or more ultracapacitor devices.

2. The method of claim 1 , further comprising:

receiving the phase change metal alloy material at a forming tool; and

using the forming tool to arrange the phase change metal alloy material adjacent to the ultracapacitor components.

3. The method of claim 1 , further comprising:

arranging the one or more ultracapacitor devices to form an ultracapacitor bank.

4. The method of claim 3 , further comprising:

arranging at least some of the phase change metal alloy material adjacent to the ultracapacitor bank.

5. The method of claim 1 , wherein the phase change metal alloy comprises at least one of Ag—Cd 44/49 at. % Cd; Au—Cd 46.5/50 at. % Cd; Au—Cd 46.5/50 at. % Cd; Cu—Al—Ni 14/14.5 wt. % Al and 3/4.5 wt. % Ni; Cu—Sn approximately 15 at. % Sn; Cu—Zn 38.5/41.5 wt. % Zn; Cu—Zn—X (X=Si, Al, Sn); Fe—Pt approx. 25 at. % Pt; Mn—Cu 5/35 at. % Cu; Fe—Mn—Si; Pt alloys; Co—Ni—Al; Co—Ni—Ga; Ni—Fe—Ga; Ti—Pd; or Ni—Ti (approximately 55% Ni).

6. The method of claim 1 , the method further comprising:

forming at least one of the separator, the support structure or current collector from the phase change metal alloy material.

7. The method of claim 1 , the method further comprising:

arranging the support structure to substantially surround an ultracapacitor core.

8. The method of claim 1 , wherein the ultracapacitor components further comprise a heat sink structure adjacent the support structure.

9. The method of claim 3 , the method further comprising:

arranging a support structure adjacent to at least a portion of the ultracapacitor bank.

10. The method of claim 9 , the method further comprising:

arranging the support structure to substantially surround the one or more ultracapacitor devices.

11. The method of claim 10 , the method further comprising:

arranging a heat sink structure adjacent to the support structure.

12. The method of claim 3 , wherein the one or more ultracapacitor devices comprise at least two ultracapcitor cells, the method further comprising:

arranging the at least two ultracapacitor cells to electrically couple together in one of a serial or a parallel manner.

13. The method of claim 1 , the method further comprising:

arranging an insulating layer to support the separator.

14. The method of claim 13 , wherein the insulating layer is porous.