Environmental sensitive electronic device package and manufacturing method thereof
An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.
1. An environmental sensitive electronic device package comprising:
a first substrate;
a second substrate located above the first substrate;
an environmental sensitive electronic device located on the first substrate and between the first substrate and the second substrate;
at least one gas barrier structures located between the first substrate and the second substrate, the gas barrier structures surrounding the environmental sensitive electronic device, each of the gas barrier structures having a first height;
a plurality of micro-structures located between the first substrate and the second substrate, each of the micro-structures having a second height, wherein a ratio of the second height to the first height ranges from 1/250 to 1/100; and
a filler layer located between the first substrate and the second substrate, the filler layer covering the gas barrier structures and the environmental sensitive electronic device.
2. The environmental sensitive electronic device package as recited in claim 1 , wherein the micro-structures are located on the first substrate.
3. The environmental sensitive electronic device package as recited in claim 1 , wherein the micro-structures are located on the second substrate.
4. The environmental sensitive electronic device package as recited in claim 1 , wherein the micro-structures are located on the gas barrier structures.
5. The environmental sensitive electronic device package as recited in claim 1 , wherein a water vapor transmission rate of the gas barrier structures is less than 10 −2 g/m 2 /day.
6. The environmental sensitive electronic device package as recited in claim 1 , wherein each of the gas barrier structures has a first width, and a ratio of the first width to the first height ranges from 4 to 6.
7. The environmental sensitive electronic device package as recited in claim 1 , wherein each of the micro-structures has a second width, and a ratio of the second width to the second height ranges from 1/10 to 1.
8. The environmental sensitive electronic device package as recited in claim 1 , wherein the micro-structures comprise protrusions with polygonal bottom areas.
9. The environmental sensitive electronic device package as recited in claim 1 , wherein each of the gas barrier structures comprises:
a rib located on the first substrate or the second substrate; and
a barrier layer covering the rib, the filler layer covering the barrier layer.
10. The environmental sensitive electronic device package as recited in claim 9 , wherein the ribs are substantially equidistantly arranged.
11. The environmental sensitive electronic device package as recited in claim 9 , wherein a shape of a cross-section of each of the ribs perpendicular to the first substrate comprises a rectangular shape, a trapezoidal shape, or a triangular shape.
12. The environmental sensitive electronic device package as recited in claim 9 , wherein a material of the ribs comprises an inorganic material or a hybrid organic-inorganic material.
13. The environmental sensitive electronic device package as recited in claim 9 , wherein a material of the barrier layers comprises an inorganic material or a metallic material.
14. The environmental sensitive electronic device package as recited in claim 1 , wherein the gas barrier structures comprise:
a first gas barrier structure located on the first substrate and extended toward the second substrate; and
a second gas barrier structure located on the second substrate and extended toward the first substrate, wherein the first gas barrier structure and the second gas barrier structure are alternately arranged between the first substrate and the second substrate.
15. A manufacturing method of an environmental sensitive electronic device package, comprising:
forming an environmental sensitive electronic device on a first substrate;
forming at least one gas barrier structures between the first substrate and the second substrate, wherein the gas barrier structures surround the environmental sensitive electronic device, and each of the gas barrier structures has a first height;
configuring a plurality of micro-structures between the first substrate and the second substrate, each of the micro-structures having a second height, wherein a ratio of the second height to the first height ranges from 1/100 to 1/250;
forming a filler layer on the first substrate to cover the environmental sensitive electronic device and the gas barrier structures; and
laminating the second substrate onto the filler layer, such that the first substrate is bonded with the second substrate through the filler layer, wherein the environmental sensitive electronic device and the gas barrier structures are located between the first substrate and the second substrate.
16. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein the micro-structures are formed on the first substrate.
17. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein the micro-structures are formed on the second substrate.
18. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein the micro-structures are formed on the gas barrier structures.
19. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein a water vapor transmission rate of the gas barrier structures is less than 10 −2 g/m 2 /day.
20. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein each of the gas barrier structures has a first width, and a ratio of the first width to the first height ranges from 4 to 6.
21. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein each of the micro-structures has a second width, and a ratio of the second width to the second height ranges from 1/10 to 1.
22. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein the micro-structures comprise protrusions with polygonal bottom areas.
23. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein a method of forming the micro-structures on the first substrate, the second substrate, and/or the gas barrier structures comprises photolithography or etching.
24. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein a method of forming the filler layer on the first substrate comprises:
forming an adhesive on the first substrate to cover the environmental sensitive electronic device and the gas barrier structures; and
curing the adhesive to form the filler layer.
25. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein a method of forming the gas barrier structures between the first substrate and the second substrate comprises:
forming at least one ribs between the first substrate and the second substrate; and
forming at least one barrier layers to cover the ribs, the filler layer covering the barrier layers.
26. The manufacturing method of the environmental sensitive electronic device package as recited in claim 25 , wherein the ribs are substantially equidistantly arranged.
27. The manufacturing method of the environmental sensitive electronic device package as recited in claim 25 , wherein the ribs located on the first substrate and the ribs located on the second substrate are alternately arranged.
28. The manufacturing method of the environmental sensitive electronic device package as recited in claim 25 , wherein a material of the ribs comprises an inorganic material or a hybrid organic-inorganic material.
29. The manufacturing method of the environmental sensitive electronic device package as recited in claim 25 , wherein a material of the barrier layers comprises an inorganic material or a metallic material.
30. The manufacturing method of the environmental sensitive electronic device package as recited in claim 15 , wherein the gas barrier structures comprise:
a first gas barrier structure formed on the first substrate and extended toward the second substrate; and
a second gas barrier structure formed on the second substrate and extended toward the first substrate, wherein the first gas barrier structure and the second gas barrier structure are alternately arranged between the first substrate and the second substrate.