Semiconductor device
Provided is a semiconductor device capable of reducing a temperature-dependent variation of a current sense ratio and accurately detecting current In the semiconductor device, at least one of an impurity concentration and a thickness of each semiconductor layer is adjusted such that a value calculated by a following equation is less than a predetermined value: [ ∑ i = 1 n ( R Mi × k Mi ) - ∑ i = 1 n ( R Si × k Si ) ] / ∑ i = 1 n ( R Mi × k Mi ) where a temperature-dependent resistance changing rate of an i-th semiconductor layer (i=1 to n) of the main element domain is R Mi ; a resistance ratio of the i-th semiconductor layer of the main element domain relative to the entire main element domain is k Mi ; a temperature-dependent resistance changing rate of the i-th semiconductor layer of the sense element domain is R Si ; and a resistance ratio of the i-th semiconductor layer of the sense element domain to the entire sense element domain is k Si .
1. A semiconductor device comprising:
a main element domain; and
a sense element domain disposed adjacent to the main element domain; wherein
each of the main element domain and the sense element domain comprises a first semiconductor layer, a second semiconductor layer directly laminated on the first semiconductor layer, and a third semiconductor layer directly laminated on the second semiconductor layer, and
an impurity concentration of the second semiconductor layer is lower than that of the first semiconductor layer,
an insulating film and a trench gate electrode penetrating the third semiconductor layer and facing the third semiconductor layer via the insulating film:
the first semiconductor layer is a continuous layer between the main element domain and the sense element domain,
the second semiconductor layer is a continuous layer between the main element domain and the sense element domain,
the third semiconductor layer is a continuous layer between the main element domain and the sense element domain via the trench gate and the insulating film,
wherein when the semiconductor device turns on, a channel is formed in each of the third semiconductor layers of the main element domain and the sense element domain, and current flows from the second semiconductor layer to the third semiconductor layer or from the third semiconductor layer to the second semiconductor layer, and
a thickness of the second semiconductor layer of the sense element domain is smaller than that of the second semiconductor layer of the main element domain.
2. The semiconductor device as in claim 1 , wherein
in at least one of the semiconductor layers from the first semiconductor layer to the third semiconductor layer of the main element domain and the sense element domain, at least one of an impurity concentration and a thickness of the at least one of the semiconductor layers of the main element domain is different from that of the at least one of the semiconductor layers of the sense element domain such that a value calculated by a following equation is less than 0.1:
[
∑
i
=
1
3
(
R
Mi
×
k
Mi
)
-
∑
i
=
1
3
(
R
Si
×
k
Si
)
]
/
∑
i
=
1
3
(
R
Mi
×
k
Mi
)
where a temperature-dependent resistance changing rate of an i-th semiconductor layer (i=1 to 3) of the main element domain is R Mi ,
a resistance ratio of the i-th semiconductor layer of the main element domain relative to the entire main element domain is k Mi ,
a temperature-dependent resistance changing rate of the i-th semiconductor layer of the sense element domain is R si , and
a resistance ratio of the i-th semiconductor layer of the sense element domain to the entire sense element domain is k Si .