Light-emitting diodes on a wafer-level package
View Patent ↗A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another.
1. A light emitter, comprising:
a first light source having a first contact pad and a second contact pad and an active area configured to emit light of a first predetermined wavelength when an electrical potential is applied across the first contact pad of the first light source and the second contact pad of the first light source;
a second light source having a first contact pad and a second contact pad and an active area configured to emit light of a second predetermined wavelength when an electrical potential is applied across the first contact pad of the second light source and the second contact pad of the second light source; and
a jumper chip comprising a first bonding area and a second bonding area that is electrically isolated from the first bonding area, wherein the first bonding area and second bonding area are created by a plurality of isolated conductive vias extending through a body of the jumper chip, wherein the first contact pad of the first light source is connected to the first bonding area of the jumper chip with a first electrical contact, wherein the first contact pad of the second light source is connected to the second bonding area of the jumper chip with a second electrical contact, and wherein the first and second electrical contacts correspond to the only connections between the first and second light sources and the jumper chip.
2. The light emitter of claim 1 , wherein the first electrical contact comprises a thin conductive film deposited across the first contact pad of the first light source and the jumper chip and wherein the second electrical contact also comprises the thin conductive film deposited across the first contact pad of the second light source and the jumper chip.
3. The light emitter of claim 2 , further comprising:
a mold material positioned around the first light source, the second light source, and the jumper chip thereby substantially fixing a relative position of the first light source, the second light source, and the jumper chip.
4. The light emitter of claim 3 , wherein the first and second electrical contacts are also deposited across a top surface of the mold material.
5. The light emitter of claim 3 , wherein the mold material comprises at least one of a black plastic, white plastic, transparent plastic, and translucent plastic.
6. The light emitter of claim 1 , wherein the first light source comprises a first bare Light Emitting Diode (LED) die and wherein the second light source comprises a second bare LED die.
7. The light emitter of claim 6 , wherein the first contact pad of the first light source corresponds to an anode or cathode of the first bare LED die, wherein the second contact pad of the first light source corresponds to a complimentary cathode or anode of the first bare LED die, wherein the first contact pad of the second light source corresponds to an anode or cathode of the second bare LED die, and wherein the second contact pad of the second light source corresponds to a complimentary cathode or anode of the second bare LED die.
8. The light emitter of claim 7 , wherein the anodes and cathodes of the first and second bare LED dies are on opposing surfaces of the bare LED dies.
9. The light emitter of claim 3 , wherein the first and second electrical contacts are provided on a common surface of the mold material.
10. The light emitter of claim 1 , wherein the jumper chip comprises a body constructed with at least one of silicon and glass and wherein the isolated conductive vias comprise a conductive material extending through the body of the jumper chip.
11. The light emitter of claim 1 , further comprising:
a third light source having a first contact pad and a second contact pad and an active area configured to emit light of a third predetermined wavelength when an electrical potential is applied across the first contact pad of the third light source and the second contact pad of the third light source, wherein the first contact pad of the third light source is connected to a third bonding area of the jumper chip with a third electrical contact.
12. The light emitter of claim 11 , wherein the first, second, and third predetermined wavelengths are different from one another.
13. The light emitter of claim 1 , wherein the first and second predetermined wavelengths are substantially the same.
14. A lighting package, comprising:
a jumper chip comprising a first pair of top and bottom contact pads and a second pair of top and bottom contact pads, the first pair of top and bottom contact pads being electrically isolated from the second pair of top and bottom contact pads, the first pair of top and bottom contact pads establishing a first bonding area on a top surface of the jumper chip, the second pair of top and bottom contact pads establishing a second bonding area on the top surface of the jumper chip;
a first light source comprising a top contact pad and bottom contact pad with an active area positioned therebetween such that electrical current flowing between the top and bottom contact pad of the first light source cause the active area to emit light of a predetermined wavelength, wherein the top contact pad of the first light source is connected to the first bonding area of the jumper chip by a first electrical contact in the form of a thin film conductive material, which corresponds to the only electrical connection between the jumper chip and the first light source; and
a mold material positioned between and around the jumper chip and the first light source, wherein the mold material provides a surface on which the first electrical contact is supported in addition to fixing the first light source relative to the jumper chip.
15. The lighting package of claim 14 , wherein the jumper chip comprises a body constructed with at least one of silicon and glass and a plurality of isolated conductive vias extending through the body.
16. The lighting package of claim 15 , wherein the plurality of isolated conductive vias are filled with a conductive material comprising at least one of gold, aluminum, and copper.
17. The lighting package of claim 14 , wherein the first light source is a bare Light Emitting Diode (LED) and wherein the first light source and jumper chip each comprise a thickness of 50 microns or less.
18. The lighting package of claim 14 , further comprising:
a second light source comprising a top contact pad and bottom contact pad with an active area positioned therebetween such that electrical current flowing between the top and bottom contact pad of the second light source cause the active area of the second light source to emit light of a predetermined wavelength, wherein the top contact pad of the second light source is connected to the second bonding area of the jumper chip by a second electrical contact in the form of the thin film conductive material.
19. An electronic device, comprising:
a light emitter comprising:
a jumper chip comprising a first pair of top and bottom contact pads and a second pair of top and bottom contact pads, the first pair of top and bottom contact pads being electrically isolated from the second pair of top and bottom contact pads, the first pair of top and bottom contact pads establishing a first bonding area on a top surface of the jumper chip, the second pair of top and bottom contact pads establishing a second bonding area on the top surface of the jumper chip;
a first light source comprising a top contact pad and bottom contact pad with an active area positioned therebetween such that electrical current flowing between the top and bottom contact pad of the first light source cause the active area to emit light of a predetermined wavelength, wherein the top contact pad of the first light source is connected to the first bonding area of the jumper chip by a single electrical contact in the form of a thin film conductive material; and
a mold material positioned between and around the jumper chip and the first light source, wherein the mold material provides a surface on which the single electrical contact is supported in addition to fixing the first light source relative to the jumper chip.
20. The electronic device of claim 19 , further comprising:
an encoder configured to generate optical communication signals by operating the light emitter; and
a fiber optic interface.
21. The light emitter of claim 1 , wherein the first light source, second light source, and jumper chip are arranged such that the second electrical contact passes over the first light source.